H05K 2201/0769
Anti metal-migration
Official title: Anti metal-migration, e.g. avoiding tin whisker growth
H05K2201/0769 (Anti metal-migration) appears on 132 US grants and 163 published applications in this corpus.
Search patents in H05K- Granted patents
- 132
- Published applications
- 163
- Assignees
- 119
- Inventors
- 412
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 5 | 0 |
| 2002 | 3 | 7 |
| 2003 | 5 | 4 |
| 2004 | 3 | 4 |
| 2005 | 3 | 4 |
| 2006 | 2 | 3 |
| 2007 | 1 | 8 |
| 2008 | 1 | 11 |
| 2009 | 6 | 11 |
| 2010 | 1 | 9 |
| 2011 | 4 | 8 |
| 2012 | 10 | 2 |
| 2013 | 8 | 4 |
| 2014 | 8 | 8 |
| 2015 | 4 | 12 |
| 2016 | 8 | 10 |
| 2017 | 7 | 8 |
| 2018 | 5 | 15 |
| 2019 | 10 | 9 |
| 2020 | 8 | 4 |
| 2021 | 9 | 8 |
| 2022 | 1 | 2 |
| 2023 | 2 | 3 |
| 2024 | 5 | 3 |
| 2025 | 1 | 1 |
| 2026 | 1 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multi-layered diamond-like carbon coating for electronic components17 Feb 2026US 12,557,207 B2Honeywell Federal Manufacturing & Technologies, LLC
- Wiring board and method of producing wiring board24 Jun 2025US 12,342,473 B2Toppan Inc.
- Circuit board, electronic device, and production method for circuit board26 Nov 2024US 12,156,346 B2Honor Device Co., Ltd.
- Elastic wiring board30 Jul 2024US 12,052,817 B2Murata Manufacturing Co., Ltd.
- Wiring board7 May 2024US 11,979,981 B2KYOCERA Corporation
- Substrate structure and power supply device3 Sep 2026US 2026/0262158 A1TDK Corporation
- Glass Barrier Layer Product, and Manufacture Method30 Jul 2026US 2026/0223288 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Printed wiring board18 Jun 2026US 2026/0173264 A1Japan Aviation Electronics Industry, Limited
- Planar solder joint with diagonal trace for determining solder dimension to prevent electromigration5 Mar 2026US 2026/0068036 A1International Business Machines Corporation
- Multilayer circuit board29 Jan 2026US 2026/0032809 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Method for making glass interposer panels73US 8,584,354 B2Corning Incorporated · 2013
- Multilayer ceramic circuit board46US 4,713,494 AHitachi, Ltd. · 1987
- Porous power and ground planes for reduced PCB delamination and better reliability42US 6,613,413 B1International Business Machines Corporation · 2003
- Prevention of surface mass migration by means of a polymeric surface coating27US 4,377,619 ABell Telephone Laboratories, Incorporated · 1983
- Electronic device packages having glass free non conductive layers22US 5,981,880 AInternational Business Machines Corporation · 1999