Multi-layered diamond-like carbon coating for electronic components
AssigneeHoneywell Federal Manufacturing & Technologies, LLC
InventorsThomas Matthew Selter, Michael Alan Walsh
Life of this patent
Estimating the term…
Abstract
A multi-layer coating on an outer surface of a substrate includes a first layer applied directly to the outer surface of the substrate. The first layer includes diamond-like carbon (DLC) configured to mitigate metal whisker formation. A second layer is applied on a top surface of the first layer. The second layer is a conformal coating that includes a second material configured to bind to the top surface of the first layer and fill any microfractures that may form in the first layer. Optionally, a third layer is applied on a top surface of the second layer and includes DLC configured to protect the second layer from oxidation and degradation.
Claims20
A multi-layer coating disposed on an outer surface of a non-conductive substrate, the multi-layer coating comprising:
- at least one diamond-like carbon (DLC) layer applied externally to the outer surface of the non-conductive substrate,
- wherein the at least one DLC layer is doped with a softening dopant;
- at least one metallization layer applied on an outer surface of the at least one DLC layer,
- wherein the at least one metallization layer is configured to provide electromagnetic shielding and environmental protection to the at least one DLC layer and the non-conductive substrate;
- and
- a subsequent DLC layer disposed on an outer surface of the at least one metallization layer.
A substrate comprising a multi-layer coating disposed on an outer surface thereof, the multi-layer coating comprising:
- at least one Plasma Vapor Deposition (PVD) layer applied externally to the outer surface of the substrate,
- wherein the at least one PVD layer is doped with a softening dopant;
- and
- at least one metallization layer applied on an outer surface of the at least one PVD layer,
- wherein the at least one metallization layer is configured to provide electromagnetic shielding and environmental protection to the substrate,
- wherein the substrate comprises a non-conductive polymer substrate.
An electronic device comprising:
- an electronic component comprising an outer surface;
- and
- a multi-layer coating disposed on the outer surface of the electronic component, the multi-layer coating comprising:
- at least one diamond-like carbon (DLC) layer applied externally to the outer surface of the electronic component,
- wherein the at least one DLC layer is doped with a softening dopant;
- at least one metallization layer applied on an outer surface of the at least one DLC layer,
- wherein the at least one metallization layer is configured to provide electromagnetic shielding and environmental protection to the electronic component;
- and
- a subsequent DLC layer disposed on an outer surface of the at least one metallization layer.
Dependencies are inferred from the claim text.