US 4,713,494 A · Multilayer ceramic circuit board

Abstract

A multilayer ceramic circuit board and method of forming such circuit board are disclosed. The wiring pattern for the multilayer ceramic circuit board includes multiple-layer portions, the multiple-layer portions including first and second electrically conductive layers, respectively a tungsten layer and a copper thick film, for example, with a diffusion layer therebetween for improving adhesivity of the first and second electrically conductive layers to each other. Such multiple-layer portions are provided by providing first and second electrically conductive layers, and an intermediate layer between the first and second electrically conductive layers, and diffusing at least one component from the intermediate layer into both the first and second electrically conductive layers. Thus, a multilayer ceramic circuit board with, e.g., a firmly coupled tungsten layer and copper thick film can be provided.

Claims17

Dependent claims

A multilayer ceramic circuit board comprising:

(a) a ceramic base means having opposed sides;
(b) a first electrically conductive layer means, of a material selected from the group consisting of Mo, W and Mo-Mn, on at least one side of said ceramic base means;
and
(c) a second electrically conductive layer means on said first electrically conductive layer means, said second electrically conductive layer means including Cu;
and wherein said board further includes
(d) diffusion layer means, between said first electrically conductive layer means and said second electrically conductive layer means, and acting as an adhesive means between the first and second electrically conductive layer means,
wherein said diffusion layer means comprising Cu, the first and second electrically conductive layer means each also including Cu from the diffusion layer means that has diffused into both of the first and second electrically conductive layer means.

4 more elements

A multilayer ceramic circuit board comprising:

(a) a ceramic base means having opposed sides;
(b) a first electrically conductive layer means, of a material selected from the group consisting of Mo, W and Mo-Mn, on at least one side of said ceramic base means;
and
(c) a second electrically conductive layer means on said first electrically conductive layer means, said second electrically conductive layer means including Cu;
and wherein said board further includes
(d) diffusion layer means, between said first electrically conductive layer means and said second electrically conductive layer means, and acting as an adhesive means between the first and second electrically conductive layer means,
wherein said diffusion layer means comprising Cu, the first and second electrically conductive layer means each also including at least one component of the diffusion layer means that has diffused into both of the first and second electrically conductive layer means.

4 more elements

Dependencies are inferred from the claim text.

Multilayer ceramic circuit board

Life of this patent

Multilayer ceramic circuit board

Life of this patent

Abstract

Claims17