US 8,584,354 B2 · Method for making glass interposer panels

Abstract

Glass interposer panels and methods for forming the same are described herein. The interposer panels include a glass substrate core formed from an ion-exchangeable glass. A first layer of compressive stress may extend from a first surface of the glass substrate into the thickness T of the glass substrate core to a first depth of layer D1. A second layer of compressive stress may be spaced apart from the first layer of compressive stress and extending from a second surface of the glass substrate core into the thickness T of the glass substrate core to a second depth of layer D2. A plurality of through-vias may extend through the thickness T of the glass substrate core. Each through-via is surrounded by an intermediate zone of compressive stress that extends from the first layer of compressive stress to the second layer of compressive stress adjacent to a sidewall of each through-via.

Claims12

Dependent claims

A method for making an interposer panel for an electronic assembly, the method comprising:

forming a plurality of through-vias in a glass substrate core;
and
inducing a first layer of compressive stress, a second layer of compressive stress, and a plurality of intermediate zones of compressive stress in the glass substrate core, wherein:
the first layer of compressive stress extends from a first surface of the glass substrate core into a thickness T of glass substrate core to a first depth of layer D1;
the second layer of compressive stress extends from a second surface of the glass substrate core into a thickness T of the glass substrate core to a second depth of layer D2 and is spaced apart from the first layer of compressive stress;
and
a sidewall of each through-via of the plurality of through-vias is surrounded by one of the plurality of intermediate zones of compressive stress, wherein each intermediate zone of compressive stress of the plurality of intermediate zones of compressive stress extends from the first layer of compressive stress to the second layer of compressive stress adjacent to the sidewall of each through-via.

4 more elements

A method for making an interposer panel for an electronic assembly, the method comprising:

forming a plurality of through-vias in a glass substrate core comprising ion-exchangeable glass;
etching the glass substrate core to remove flaws from the glass substrate core, wherein a strength of the glass substrate core is greater after etching than before etching;
and
strengthening the glass substrate core by ion exchange to:
form a first layer of compressive stress extending from a first surface of the glass substrate core into a thickness T of the glass substrate core, wherein the first layer of compressive stress has a first depth of layer D1;
form a second layer of compressive stress extending from a second surface of the glass substrate core into the thickness T of the glass substrate core, wherein the second layer of compressive stress has a second depth of layer D2 and is spaced apart from the first layer of compressive stress;
and
form a plurality of intermediate zones of compressive stress corresponding to the plurality of through-vias, wherein each through-via of the plurality of through-vias is surrounded by a corresponding one of the plurality of intermediate zones of compressive stress.

5 more elements

Dependencies are inferred from the claim text.

Method for making glass interposer panels

Life of this patent

Method for making glass interposer panels

Life of this patent

Abstract

Claims12