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AssigneeBell Telephone Laboratories, Incorporated
InventorsHarold Schonhorn, Louis H. Sharpe
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Method for preventing spreading of a liquid on a solid surface, e.g., an adhesive placed on a substrate, and for preventing metal migration, in particular silver migration, between conductors deposited on a surface of a substrate, and articles produced by the method. The method comprises application of a layer of polymer having room temperature critical surface tension of wetting less than about 20 dyn/cm, and less than about 0.1 .mu.m thick, to at least a part of the surface. The polymer layer can be applied by any convenient method, including dipping, spraying, painting, printing, and plasma deposition. A preferred polymer is poly(1H, 1H-pentadecafluorooctyl methacrylate) (PDFOM), which can be advantageously applied in the form of a solution, typically in a fluorinated hydrocarbon such as Freon.RTM. TF, with PDFOM concentration typically between about 0.001% and about 2% by weight. Thin PDFOM layers according to the invention covering the substrate area on which the adhesive is placed later do not unduly decrease the strength of the adhesive bond formed, and have no measurable effect on the electrical conductivity of a conducting adhesive bond. Because of these properties, a substrate surface can be coated with PDFOM, such as by dipping or spraying, and the adhesive be applied to the coated surface. Metal migration is prevented by preventing formation of a continuous electrolyte film, typically an aqueous film, between conductors at different electrical potentials. This can be achieved by coating at least a part of the substrate with the polymer, e.g., PDFOM.
Method for fabricating an article comprising a substrate having at least one first surface region covered with a substance at least part of which is capable of undergoing surface mass migration, and at least one second surface region that is not covered with the substance, the method comprising
Method for fabricating an article comprising a substrate and a solid item affixed to a surface of the substrate by means of adhesive bonding, the method comprising
Method for fabricating an article comprising a substrate and a solid item affixed to a surface of the substrate by means of adhesive bonding, the method comprising
Method for fabricating an article comprising a plurality of spaced apart electrical conductors comprisng metallic silver deposited on an insulating substrate, the method comprising
Article comprising
Article comprising
Article comprising
Method for manufacturing an article comprising a substrate and a semiconductor device affixed to a substrate surface by means of an adhesive,characterized in that the method comprises disposing a layer, consisting essentially of polymer having a room temperature critical surface tension of wetting less than about 20 dyn/cm, the layer being less than about 0.1 .mu.m thick, over at least a part of the substrate surface including the area to which the device is to be affixed.
Method for manufacturing an article comprising a substrate and a semiconductor device affixed to a substrate surface by means of an adhesive characterized in that the method comprises disposing a layer, consisting essentially of polymer having a room temperature critical surface tension of wetting less than about 20 dyn/cm, the layer being less than about 0.1 .mu.m thick, over at least a part of the substrate surface and over at least a part of the device.
Method for manufacturng an article comprising a substrate and a plurality of spaced apart electrical conductors comprising metallic silver deposited on a surface of the substrate, characterized in that the method comprises disposing a layer, consisting essentially of polymer having a room temperature critical surface tension of wetting less than about 20 dyn/cm, the layer being less than about 0.1 .mu.m thick, over at least a part of the substrate surface.
Dependencies are inferred from the claim text.