H05K 2201/0753
Insulation
H05K2201/0753 (Insulation) appears on 232 US grants and 275 published applications in this corpus.
Search patents in H05K- Granted patents
- 232
- Published applications
- 275
- Assignees
- 203
- Inventors
- 726
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 8 | 2 |
| 2002 | 6 | 8 |
| 2003 | 6 | 7 |
| 2004 | 8 | 16 |
| 2005 | 7 | 9 |
| 2006 | 5 | 9 |
| 2007 | 7 | 10 |
| 2008 | 2 | 18 |
| 2009 | 8 | 18 |
| 2010 | 4 | 12 |
| 2011 | 5 | 13 |
| 2012 | 12 | 3 |
| 2013 | 12 | 8 |
| 2014 | 13 | 10 |
| 2015 | 8 | 15 |
| 2016 | 9 | 13 |
| 2017 | 10 | 10 |
| 2018 | 6 | 18 |
| 2019 | 12 | 10 |
| 2020 | 11 | 9 |
| 2021 | 12 | 13 |
| 2022 | 5 | 8 |
| 2023 | 6 | 8 |
| 2024 | 10 | 11 |
| 2025 | 4 | 8 |
| 2026 | 3 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Package capable of eliminating bubble formation26 May 2026US 12,641,714 B2Panjit International Inc.
- Display screen including flexible printed circuit and electronic device12 May 2026US 12,628,266 B2Vivo Mobile Communication Co., Ltd.
- Multi-layered diamond-like carbon coating for electronic components17 Feb 2026US 12,557,207 B2Honeywell Federal Manufacturing & Technologies, LLC
- Circuit board and manufacturing method thereof23 Dec 2025US 12,507,348 B2Samsung Electro-Mechanics Co., Ltd.
- Printed circuit board and disk device30 Sep 2025US 12,432,854 B2Kabushiki Kaisha Toshiba
- Fixing structure for electronic module and electronic module1 Oct 2026US 2026/0304595 A1Shindengen Electric Manufacturing Co., Ltd.
- Substrate structure and power supply device3 Sep 2026US 2026/0262158 A1TDK Corporation
- Circuit board and manufacturing method thereof27 Aug 2026US 2026/0255475 A1Avary Holding (Shenzhen) Co., Limited.
- Glass Barrier Layer Product, and Manufacture Method30 Jul 2026US 2026/0223288 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Induction heating device comprising temperature sensor provided in stacked boards on which heating coils are printed2 Jul 2026US 2026/0190188 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition270US 5,380,560 AInternational Business Machines Corporation · 1995
- Selective electroless plating process for metal conductors94US 5,167,992 AMicroelectronics and Computer Technology Corporation · 1992
- Method for making glass interposer panels73US 8,584,354 B2Corning Incorporated · 2013
- Multilayer ceramic circuit board46US 4,713,494 AHitachi, Ltd. · 1987
- Porous power and ground planes for reduced PCB delamination and better reliability42US 6,613,413 B1International Business Machines Corporation · 2003