H05K 2201/0761
Insulation resistance
Official title: Insulation resistance, e.g. of the surface of the PCB between the conductors
H05K2201/0761 (Insulation resistance) appears on 99 US grants and 109 published applications in this corpus.
Search patents in H05K- Granted patents
- 99
- Published applications
- 109
- Assignees
- 93
- Inventors
- 312
- Latest grant
- 12 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 2 |
| 2002 | 3 | 2 |
| 2003 | 1 | 3 |
| 2004 | 5 | 12 |
| 2005 | 4 | 5 |
| 2006 | 4 | 7 |
| 2007 | 6 | 2 |
| 2008 | 1 | 8 |
| 2009 | 2 | 7 |
| 2010 | 3 | 4 |
| 2011 | 1 | 5 |
| 2012 | 2 | 1 |
| 2013 | 5 | 4 |
| 2014 | 4 | 2 |
| 2015 | 3 | 4 |
| 2016 | 3 | 5 |
| 2017 | 3 | 2 |
| 2018 | 1 | 4 |
| 2019 | 3 | 1 |
| 2020 | 3 | 4 |
| 2021 | 3 | 6 |
| 2022 | 3 | 5 |
| 2023 | 4 | 5 |
| 2024 | 5 | 4 |
| 2025 | 1 | 3 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Display screen including flexible printed circuit and electronic device12 May 2026US 12,628,266 B2Vivo Mobile Communication Co., Ltd.
- Stand off structures for electronic circuits9 Sep 2025US 12,412,703 B2Kromek Limited
- Insulating resin circuit substrate24 Dec 2024US 12,177,962 B2Mitsubishi Materials Corporation
- Bearing structure for high-low-voltage conversion circuit17 Sep 2024US 12,096,582 B2Delta Electronics, Inc.
- Wiring board23 Jul 2024US 12,048,087 B2KYOCERA Corporation
- Arrangement with a printed circuit board and a circuit for detecting carbonization of the printed circuit board25 Jun 2026US 2026/0181782 A1Hella GmbH & Co. KGaA
- Printed wiring board18 Jun 2026US 2026/0173264 A1Japan Aviation Electronics Industry, Limited
- Printed Circuit Board Creep Corrosion Sensor and Sensing Method23 Oct 2025US 2025/0327735 A1Ciena Corporation
- Component Carrier, Component Carrier Arrangement and Method of Manufacturing the Component Carrier25 Sep 2025US 2025/0300060 A1AT&S (Chongqing) Company Limited
- Coverlay as printed circuit board (pcb) voltage insulator under connectors10 Jul 2025US 2025/0227854 A1Hamilton Sundstrand Corporation
Most cited
By later US patents
- Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition270US 5,380,560 AInternational Business Machines Corporation · 1995
- Selective electroless plating process for metal conductors94US 5,167,992 AMicroelectronics and Computer Technology Corporation · 1992
- Method for forming a ceramic circuit board37US 5,354,415 ADenki Kagaku Kogyo Kabushiki Kaisha · 1994
- Systems and methods for obtaining large creepage isolation on printed circuit boards35US 9,049,783 B2HistoSonics, Inc. · 2015
- Laminate and method of manufacture thereof30US 6,207,595 B1International Business Machines Corporation · 2001