US 5,354,415 AGranted

Method for forming a ceramic circuit board

AssigneeDenki Kagaku Kogyo Kabushiki Kaisha

InventorsYasuhito Fushii, Miyuki Nakamura, Yukihiko Nakajima, Kazuo Kato, Akira Miyai, Kazuyuki Hiruta

Life of this patent

Estimating the term…

Abstract

Method for forming a ceramic circuit board by forming a metal circuit pattern on a ceramic board through an active metal ingredient-containing brazing material and removing an unnecessary part of the brazing material by chemical liquor treatment.

Claims25

Dependent claims

A method for forming a ceramic circuit board, comprising forming a metal circuit pattern on a ceramic board by means of an active metal ingredient-containing brazing material and removing an unnecessary part of the brazing material by chemical liquor treatment.

Dependencies are inferred from the claim text.

Facts

Application: 08/000,584Filed 4 Jan 1993 · continuation
Priority: JP 2-9752316 Apr 1990
Granted: 11 Oct 1994
Term ends: Not estimatedThe source records don’t support an estimate.

Classification26 codes

H05K 3/06
In which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface…:…
C04B 37/026
Characterised by the interlayer used: consisting of metals or metal salts
H05K 3/26
Secondary treatment of printed circuits: cleaning or polishing of the conductive pattern
H05K 3/38
Apparatus or processes for manufacturing printed circuits: improvement of the adhesion between the insulating substrate and the metal

Family

Serial778,211Parent of this continuation · filed 16 Dec 1991
US 5,354,415 AThis patent

From the US filing history. Foreign family members aren’t listed.

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