Electronic device packages having glass free non conductive layers
AssigneeInternational Business Machines Corporation
InventorsBernd Karl-Heinz Appelt, Anilkumar Chinuprasad Bhatt, James W. Fuller, Jr., John Matthew Lauffer, Voya Rista Markovich, William John Rudik, William Earl Wilson
Life of this patent
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Abstract
A printed circuit board for use in an electronic device package such as a ball grid array package or organic chip carrier package includes a glass-free dielectric for separating and insulating power cores, circuitry or plated through holes from each other to prevent shorts caused by a migration of conductive material along glass-based prepreg substrates.
Claims3
An electronic device package comprising:
- at least one substrate, said substrate comprising impregnated glass fibers;
- an electronic device coupled to said substrate;
- a non-conductive layer comprising a dielectric material free of continuous glass fibers applied to said substrate;
- electrically conductive circuitry comprising a conductive material formed on said non-conductive layer or formed on said substrate such that said non-conductive layer lies between said substrate and said conductive material to prevent shorts therebetween caused by migration of said conducting material along said glass fibers;
- and
- a power plane encapsulated by said non-conductive layer.
An electronic device package comprising:
- a non-conductive substrate comprising a dielectric material free of continuous glass fibers;
- an electronic device coupled to said substrate;
- electrically conductive circuitry comprising a conductive material formed on said substrate wherein said electronic device is electrically coupled to said circuitry;
- and power plane:
- (a) laminated to said substrate such that said dielectric material lies between said circuitry and said power plane, and
- (b) encapsulated within said substrate.
An electronic device package comprising:
- at least one substrate, said substrate comprising impregnated glass fibers;
- at least one plated through hole extending through said substrate;
- an electronic device coupled to said substrate;
- at least one conductive power plane;
- and
- a non-conductive layer:
- (a) comprising a dielectric material free of continuous glass fibers positioned between said plated through hole and each said power plane to prevent a short therebetween caused by migration of conductive material along said glass fibers, and
- (b) completely encapsulating said power plane.
Dependencies are inferred from the claim text.