H05K 1/0224
Patterned shielding planes, ground planes or power planes
Official title: {Patterned shielding planes, ground planes or power planes (H05K1/0253 takes precedence)}
H05K1/0224 (Patterned shielding planes, ground planes or power planes) appears on 883 US grants and 961 published applications in this corpus.
Search patents in H05K- Granted patents
- 883
- Published applications
- 961
- Assignees
- 394
- Inventors
- 1,933
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 6 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 4 | 0 |
| 1998 | 6 | 0 |
| 1999 | 10 | 0 |
| 2000 | 5 | 0 |
| 2001 | 10 | 8 |
| 2002 | 12 | 8 |
| 2003 | 10 | 7 |
| 2004 | 12 | 17 |
| 2005 | 8 | 13 |
| 2006 | 9 | 16 |
| 2007 | 12 | 25 |
| 2008 | 24 | 30 |
| 2009 | 14 | 33 |
| 2010 | 11 | 26 |
| 2011 | 23 | 26 |
| 2012 | 34 | 47 |
| 2013 | 21 | 43 |
| 2014 | 31 | 62 |
| 2015 | 44 | 77 |
| 2016 | 57 | 47 |
| 2017 | 66 | 42 |
| 2018 | 47 | 54 |
| 2019 | 69 | 63 |
| 2020 | 69 | 73 |
| 2021 | 50 | 54 |
| 2022 | 54 | 52 |
| 2023 | 43 | 44 |
| 2024 | 41 | 38 |
| 2025 | 47 | 31 |
| 2026 | 18 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Circuit board6 Oct 2026US 12,757,318 B2Dongwoo Fine-Chem Co., Ltd.
- Core resonance suppression in signal integrity optimized package15 Sep 2026US 12,739,967 B2Avago Technologies International Sales Pte. Limited
- Collapse-free circuit structure with low capacitance effect15 Sep 2026US 12,739,969 B2Unimicron Technology Corp.
- PCB fabrication with EMI film on multi-layer rigid PCB8 Sep 2026US 12,733,089 B2Intel Corporation
- Structurally enhanced filtering of circuit board planes18 Aug 2026US 12,713,518 B2Microsoft Technology Licensing, LLC
- Wiring board and head-mounted display17 Sep 2026US 2026/0282208 A1Dai Nippon Printing Co.Ltd.
- Power module and power device27 Aug 2026US 2026/0254351 A1Hoymiles Power Electronics Inc.
- Component Carrier With Components Shielded by Vertical Partitioning Structures Disconnected in a Shielding Region16 Jul 2026US 2026/0206600 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Multilayer substrate9 Jul 2026US 2026/0197932 A1Murata Manufacturing Co., Ltd.
- Flexible circuit board and display device9 Jul 2026US 2026/0197936 A1Boe Technology Group Co., Ltd.
Most cited
By later US patents
- Multi-layer circuit substrate having orthogonal grid ground and power planes188US 6,184,477 B2KYOCERA Corporation · 2001
- Card-type electronic device with plastic frame sandwiched between printed circuit boarding metal panel150US 5,784,259 ASeiko Epson Corporation · 1998
- Multilayer wiring structure for attaining high-speed signal propagation143US 5,633,479 AKabushiki Kaisha Toshiba · 1997
- Card-type electronic device with plastic frame sandwiched between printed circuit board and metal panel137US 5,742,479 ASeiko Epson Corporation · 1998
- Multilayer printed board120US 5,926,377 AFujitsu Limited · 1999