H05K 1/0227
Split or nearly split shielding or ground planes
Official title: {Split or nearly split shielding or ground planes}
H05K1/0227 (Split or nearly split shielding or ground planes) appears on 126 US grants and 145 published applications in this corpus.
Search patents in H05K- Granted patents
- 126
- Published applications
- 145
- Assignees
- 113
- Inventors
- 362
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 2 |
| 2003 | 0 | 1 |
| 2004 | 3 | 2 |
| 2005 | 0 | 2 |
| 2006 | 1 | 4 |
| 2007 | 1 | 3 |
| 2008 | 4 | 2 |
| 2009 | 2 | 0 |
| 2010 | 1 | 6 |
| 2011 | 2 | 5 |
| 2012 | 3 | 13 |
| 2013 | 6 | 10 |
| 2014 | 6 | 9 |
| 2015 | 7 | 8 |
| 2016 | 14 | 11 |
| 2017 | 10 | 6 |
| 2018 | 6 | 9 |
| 2019 | 8 | 10 |
| 2020 | 13 | 9 |
| 2021 | 6 | 7 |
| 2022 | 5 | 8 |
| 2023 | 6 | 3 |
| 2024 | 5 | 6 |
| 2025 | 6 | 4 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board including interdigital slots and/or splits on reference planes for reducing EMI5 May 2026US 12,621,926 B2Turkiye Bilimsel Ve Teknolojik Arastirma Kurumu
- Circuit board20 Jan 2026US 12,532,409 B2Niko Semiconductor Co., Ltd.
- High-frequency signal transmission device and high-frequency signal transmission cable18 Nov 2025US 12,477,653 B2Yamaichi Electronics Co., Ltd.
- Circuit board7 Oct 2025US 12,439,506 B2SK hynix Inc.
- Printed circuit board and electronic device including the same2 Sep 2025US 12,408,274 B2Samsung Electronics Co., Ltd.
- Component Carrier With Components Shielded by Vertical Partitioning Structures Disconnected in a Shielding Region16 Jul 2026US 2026/0206600 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wiring board and vehicle display device2 Apr 2026US 2026/0096014 A1Nippon Seiki Co., Ltd.
- Aerosol generating device comprising plurality of circuit boards12 Mar 2026US 2026/0075698 A1Kt&G Corporation
- Wiring board, electronic component mounting package including wiring board, and electronic module26 Feb 2026US 2026/0059654 A1KYOCERA Corporation
- Preparation method for a selective electromagnetic shielding and an electronic product20 Nov 2025US 2025/0358991 A1Universal Global Technology (Shanghai) Co., Ltd.
Most cited
By later US patents
- Multilayer printed board120US 5,926,377 AFujitsu Limited · 1999
- Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board.101US 6,353,540 B1Hitachi, Ltd. · 2002
- Circuit board voltage plane impedance matching81US 6,150,895 ADell USA, L. P. · 2000
- Systems and methods for obtaining large creepage isolation on printed circuit boards35US 9,049,783 B2HistoSonics, Inc. · 2015
- Printed circuit board including a terminated power plane and method of manufacturing the same34US 5,898,576 ABay Networks, Inc. · 1999