H05K 1/0218
By printed shielding conductors, ground planes or power plane
Official title: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)}
H05K1/0218 (By printed shielding conductors, ground planes or power plane) appears on 3,541 US grants and 3,733 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,541
- Published applications
- 3,733
- Assignees
- 1,129
- Inventors
- 7,343
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 5 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 7 | 0 |
| 1986 | 7 | 0 |
| 1987 | 11 | 0 |
| 1988 | 14 | 0 |
| 1989 | 15 | 0 |
| 1990 | 16 | 0 |
| 1991 | 24 | 0 |
| 1992 | 19 | 0 |
| 1993 | 17 | 0 |
| 1994 | 37 | 0 |
| 1995 | 25 | 0 |
| 1996 | 24 | 0 |
| 1997 | 14 | 0 |
| 1998 | 34 | 0 |
| 1999 | 42 | 0 |
| 2000 | 40 | 0 |
| 2001 | 58 | 24 |
| 2002 | 66 | 70 |
| 2003 | 55 | 81 |
| 2004 | 87 | 115 |
| 2005 | 68 | 104 |
| 2006 | 97 | 122 |
| 2007 | 73 | 117 |
| 2008 | 97 | 138 |
| 2009 | 66 | 152 |
| 2010 | 87 | 137 |
| 2011 | 106 | 122 |
| 2012 | 127 | 134 |
| 2013 | 102 | 145 |
| 2014 | 108 | 151 |
| 2015 | 149 | 191 |
| 2016 | 135 | 133 |
| 2017 | 177 | 140 |
| 2018 | 146 | 166 |
| 2019 | 188 | 171 |
| 2020 | 188 | 196 |
| 2021 | 150 | 216 |
| 2022 | 193 | 229 |
| 2023 | 182 | 255 |
| 2024 | 189 | 165 |
| 2025 | 194 | 143 |
| 2026 | 88 | 116 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Technologies for reducing the impact of radiofrequency interference on a circuit board6 Oct 2026US 12,757,317 B2Intel Corporation
- Circuit board6 Oct 2026US 12,757,318 B2Dongwoo Fine-Chem Co., Ltd.
- Single layer and multilayer magnetic inductors between substrate cores6 Oct 2026US 12,757,740 B2Intel Corporation
- Core resonance suppression in signal integrity optimized package15 Sep 2026US 12,739,967 B2Avago Technologies International Sales Pte. Limited
- Collapse-free circuit structure with low capacitance effect15 Sep 2026US 12,739,969 B2Unimicron Technology Corp.
- Circuit board and electronic device comprising same1 Oct 2026US 2026/0304598 A1Samsung Electronics Co., Ltd.
- Single layer and multilayer magnetic inductors between substrate cores1 Oct 2026US 2026/0305365 A1Intel Foundry IP LLC
- Storage device, semiconductor device and electronic apparatus24 Sep 2026US 2026/0291219 A1Yangtze Memory Technologies Co., Ltd.
- Display device and method of manufacturing the same24 Sep 2026US 2026/0293498 A1Samsung Display Co., Ltd.
- Wiring board and electronic device17 Sep 2026US 2026/0282206 A1KYOCERA Corporation
Most cited
By later US patents
- Flex circuit shielded optical sensor1,182US 6,985,764 B2Masimo Corporation · 2006
- Flex circuit shielded optical sensor935US 7,340,287 B2Masimo Corporation · 2008
- Shielded electronic component assembly and method for making the same392US 5,639,989 AMotorola, Inc. · 1997
- Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system387US 7,619,901 B2EPIC Technologies, Inc. · 2009
- Memory system having synchronous-link DRAM (SLDRAM) devices and controller383US 6,442,644 B1Advanced Memory International, Inc. · 2002