Circuit board and electronic device comprising same
AssigneeSamsung Electronics Co., Ltd.
InventorsYoungsun LEE, Byeongkeol KIM
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AssigneeSamsung Electronics Co., Ltd.
InventorsYoungsun LEE, Byeongkeol KIM
Estimating the term…
The present disclosure relates to a circuit board. The circuit board according to an embodiment of the present disclosure may comprise a substrate layer positioned on a first portion of the circuit board and a second portion of the circuit board, the second portion being different from the first portion, a power line positioned on the first portion of the circuit board, a signal line positioned on the second portion of the circuit board, a shielding layer spaced apart from the power line and the signal line, and a cover layer positioned between the substrate layer and the shielding layer, wherein the cover layer includes a cover substrate layer positioned on the first portion and the second portion of the circuit board, a conductive layer positioned on the first portion of the circuit board to correspond to the power line and positioned between the cover substrate layer and the shielding layer, and an insulating layer positioned on the second portion of the circuit board to correspond to the signal line and disposed between the cover substrate layer and the shielding layer.
A circuit board comprising:
Dependencies are inferred from the claim text.