H05K 1/0222
For shielding around a single via or around a group of vias
Official title: {for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence}
H05K1/0222 (For shielding around a single via or around a group of vias) appears on 415 US grants and 464 published applications in this corpus.
Search patents in H05K- Granted patents
- 415
- Published applications
- 464
- Assignees
- 218
- Inventors
- 1,019
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 1 |
| 2002 | 10 | 8 |
| 2003 | 3 | 9 |
| 2004 | 11 | 12 |
| 2005 | 6 | 9 |
| 2006 | 13 | 22 |
| 2007 | 6 | 15 |
| 2008 | 15 | 13 |
| 2009 | 8 | 16 |
| 2010 | 16 | 16 |
| 2011 | 15 | 20 |
| 2012 | 16 | 10 |
| 2013 | 13 | 20 |
| 2014 | 14 | 16 |
| 2015 | 16 | 22 |
| 2016 | 11 | 13 |
| 2017 | 23 | 16 |
| 2018 | 21 | 20 |
| 2019 | 30 | 23 |
| 2020 | 27 | 25 |
| 2021 | 21 | 22 |
| 2022 | 20 | 28 |
| 2023 | 27 | 35 |
| 2024 | 30 | 22 |
| 2025 | 17 | 31 |
| 2026 | 11 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Structurally enhanced filtering of circuit board planes18 Aug 2026US 12,713,518 B2Microsoft Technology Licensing, LLC
- Vertical conductive structure transition impedance optimization16 Jun 2026US 12,660,083 B2International Business Machines Corporation
- Circuit board device9 Jun 2026US 12,652,752 B2Unimicron Technology Corp.
- Impedance matched via connections in a printed circuit board9 Jun 2026US 12,652,757 B2The Phoenix Company of Chicago, Inc.
- Via assembly for printed circuit board31 Mar 2026US 12,593,396 B2Cisco Technology, Inc.
- Wiring board, electronic device, and electronic module17 Sep 2026US 2026/0282207 A1KYOCERA Corporation
- Flexible circuit board and electronic device10 Sep 2026US 2026/0271179 A1Huawei Technologies Co., Ltd.
- Printed circuit board hardware interface with reduced crosstalk20 Aug 2026US 2026/0247522 A1Microsoft Technology Licensing, LLC
- Printed circuit board (pcb) miniaturization by an embedded via-in-via design30 Jul 2026US 2026/0223279 A1Google Inc.
- Circuit board for connectors18 Jun 2026US 2026/0173254 A1Min Di Consultants Ltd.
Most cited
By later US patents
- Multi-connection via with electrically isolated segments154US 6,388,208 B1Teradyne, Inc. · 2002
- Backplane for radio frequency signals134US 6,392,160 B1Lucent Technologies Inc. · 2002
- Printed circuit board for RF connector mounting119US 9,022,806 B2Amphenol Corporation · 2015
- High performance connector contact structure113US 9,225,085 B2Amphenol Corporation · 2015
- Wiring board, wiring board fabrication method, and semiconductor package112US 6,353,189 B1Kabushiki Kaisha Toshiba · 2002