Wiring board, wiring board fabrication method, and semiconductor package

A wiring board, comprising:

• a transmission line;
• two sheets of shielding plates disposed above and below the transmission line along the transmission line;
• an insulating layer disposed between the transmission line and the shielding plates;
• and
• conductive member that is disposed on both sides of the transmission line along the transmission line and connects electrically between the two sheets of shielding plates;
• wherein the conductive member is formed in such a way that on corresponding positions of the two sheets of shielding plates a plurality of substantially conical conductive pillars are disposed in one row, and in a state of sandwiching the insulating layer between the two sheets of shielding plates, the two sheets of shielding plates are pressed to make the substantially conical conductive pillars pierce through the insulating layer, and thereby at least between tip ends of the substantially conical conductive pillars and the shielding plate facing the tip ends are made contact.

A fabricating method of a wiring board, comprising the steps of:

• forming a plurality of substantially conical conductive pillars on a portion where a shield pattern of a first conductor is destined to be formed;
• forming a plurality of substantially conical conductive pillars on a portion where a shield pattern of a second conductor plate is destined to be formed;
• pressing while sandwiching a board intermediate between the first conductor plate and the second conductor plate to connect electrically between the first conductor plate and the second conductor plate through the substantially conical conductive pillars;
• and
• curing the board intermediate.

A fabricating method of a wiring board, comprising the steps of:

• forming a plurality of substantially conical conductive pillars on a portion where a shield pattern of a first conductor plate is destined to be formed;
• forming a plurality of substantially conical conductive pillars on a portion where a shield pattern of a second conductor plate is destined to be formed;
• pressing while sandwiching a board intermediate between the first conductor plate and the second conductor plate to connect electrically the first conductor plate and the second conductor plate through the substantially conical conductive pillars;
• forming a transmission line and a shield pattern on the second conductor plate;
• forming a plurality of substantially conical conductive pillars on the shield pattern;
• forming a plurality of substantially conical conductive pillars on a portion where a shield pattern of a third conductor plate is destined to be formed;
• pressing while sandwiching a second board intermediate between the first board intermediate and the third conductor plate to electrically connect the shield pattern and the third conductor plate through the substantially conical conductive pillars;
• and
• curing the board intermediate.

A wiring board, comprising:

• a first conductor layer having a first surface and a second surface;
• a second conductor layer facing the first surface of the first conductor layer through a first insulating layer;
• first interconnect cavity penetrated into the first insulating layer in the thickness direction of the first insulating layer to interconnect one surface of the first insulating layer with another surface of the first insulating layer;
• first interconnect layer formed onto inner surface of the first interconnect cavity;
• a third conductor layer facing the second surface of the first conductor layer through a second insulating layer;
• second interconnect cavity formed on the position shifted from the first interconnect cavity in a longitudinal direction of the second insulating layer, and penetrated into the second insulating layer in the thickness direction of the second insulating layer to interconnect one surface of the second insulating layer with another surface of the second insulating layer;
• second interconnect layer formed onto inner surface of the second interconnect cavity and contacted with the first interconnect cavity.

A wiring board, comprising:

• a first board made of an insulating material, having a first hardness;
• a second board stacked directly with the first board and having a second hardness smaller than the first hardness;
• and
• a conductive pillar disposed piercing the second board.

A fabricating method of a wiring board comprising:

• forming a first wiring layer having a first via-land on a first surface of a first board made of an insulating material, having a first hardness;
• forming on the first via-land a substantially conical conductive pillar having a third hardness smaller than the first hardness;
• disposing a second board disposed on a second wiring layer having a second via-land on a first surface and having a second hardness smaller than the first hardness to face a first surface of the first board through uncured prepreg;
• and
• pressing the first board, the prepreg and the second board in thickness direction to make the conductive pillar pierce through the prepreg, thereby connecting electrically the first via-land and the second via-land.