Via assembly for printed circuit board
AssigneeCisco Technology, Inc.
InventorsMike Sapozhnikov, Amendra Koul, David Nozadze, Joel Richard Goergen, Upen Reddy Kareti, Sayed Ashraf Mamun
Life of this patent
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Abstract
Provide for herein is an apparatus that includes multiple printed circuit board (PCB) layers and a via assembly. The via assembly includes a signal via extending through the multiple layers, and the signal via is configured to transmit a signal between the layers. The via assembly also includes a capacitive structure connected to the signal via to adjust an impedance of the via assembly along the via assembly. The capacitive structure is physically and electrically separate from other components of the PCB.
Claims13
An apparatus, comprising:
- a layer of a printed circuit board (PCB);
- a signal via extending through the layer, wherein the signal via is configured to transmit a signal therethrough;
- a capacitive structure connected to the signal via at the layer, wherein the capacitive structure is electrically separate from each other component of the PCB at the layer;
- an additional layer of the PCB;
- a trace routed along the additional layer;
- a pad connected to the signal via at the additional layer, wherein the pad is connected to the trace to electrically couple the signal via and the pad to one another;
- and
- a plurality of ground vias positioned at the additional layer and within a threshold distance of the signal via, wherein a quantity of the plurality of ground vias is greater than a threshold quantity.
An apparatus comprising:
- a plurality of layers of a printed circuit board (PCB);
- and
- a via assembly comprising:
- a signal via extending from a first layer of the plurality of layers to a second layer of the plurality of layers;
- and
- a capacitive structure connected to the signal via between the first layer and the second layer, wherein the capacitive structure is physically separate from each other component of the PCB, and the capacitive structure is positioned along the signal via to limit a change in impedance of the via assembly from the first layer to the second layer within a threshold value.
Dependencies are inferred from the claim text.