H01S 5/0238
Using marks
Official title: using marks
H01S5/0238 (Using marks) appears on 61 US grants and 80 published applications in this corpus.
Search patents in H01S- Granted patents
- 61
- Published applications
- 80
- Assignees
- 57
- Inventors
- 185
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 2 |
| 2002 | 3 | 4 |
| 2003 | 3 | 0 |
| 2004 | 2 | 5 |
| 2005 | 3 | 1 |
| 2006 | 3 | 3 |
| 2007 | 2 | 2 |
| 2008 | 0 | 1 |
| 2009 | 0 | 2 |
| 2010 | 1 | 2 |
| 2011 | 1 | 0 |
| 2012 | 1 | 2 |
| 2013 | 0 | 0 |
| 2014 | 1 | 0 |
| 2015 | 1 | 2 |
| 2016 | 0 | 2 |
| 2017 | 2 | 3 |
| 2018 | 3 | 6 |
| 2019 | 5 | 4 |
| 2020 | 6 | 11 |
| 2021 | 1 | 3 |
| 2022 | 3 | 6 |
| 2023 | 4 | 9 |
| 2024 | 3 | 3 |
| 2025 | 3 | 5 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods for 3D-integrating photonic chipsets by vertical assembly of lasers and passive components5 May 2026US 12,620,783 B1HRL Laboratories, LLC
- Semiconductor laser device17 Mar 2026US 12,580,364 B2Nuvoton Technology Corporation Japan
- Semiconductor optical device and method of manufacturing semiconductor optical device6 Jan 2026US 12,519,283 B2Furukawa Electric Co., Ltd.
- Method for III-V/silicon hybrid integration4 Nov 2025US 12,461,308 B2Rockley Photonics Limited
- Semiconductor laser element, light emitting device, and method for manufacturing these9 Sep 2025US 12,413,042 B2Nichia Corporation
- Carrier based laser assembly for high volume integration onto a substrate7 May 2026US 2026/0128566 A1Ranovus Inc.
- Vertical cavity surface emitting laser and method for producing same12 Mar 2026US 2026/0074487 A1Trumpf Photonic Components GmbH
- Optical module and method of manufacturing optical module30 Oct 2025US 2025/0334759 A1Furukawa Electric Co., Ltd.
- Methods Of Forming Optical Modules16 Oct 2025US 2025/0324794 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Self-aligned buried hetero structure laser structures and interposer1 May 2025US 2025/0138260 A1POET Technologies, Inc.
Most cited
By later US patents
- Optimized solder pads for solder induced alignment of opto-electronic chips42US 9,543,736 B1International Business Machines Corporation · 2017
- Integrated microsystem34US 5,265,113 AMesserschmitt-Bolkow-Blohm GmbH · 1993
- Wavelength-variable semiconductor laser, optical integrated device utilizing the same, and production method thereof16US 6,693,936 B2Matsushita Electric Industrial Co., Ltd. · 2004
- System and method of packaging a laser/detector14US 6,577,656 B2Finisar Corporation · 2003
- Method for fabricating fiducials for passive alignment of opto-electronic devices12US 6,625,357 B2Tyco Electronics Corporation · 2003