Carrier based laser assembly for high volume integration onto a substrate

Abstract

A carrier based laser assembly for high volume integration onto a substrate is provided. In particular, a device is provided that includes: a semiconductor laser comprising: a laser body comprising a laser end; a laser output at the laser end; and one or more first mating surfaces along the laser body; and a carrier comprising: a carrier body; and one or more second mating surfaces along the carrier body. The one or more first mating surfaces and the one or more second mating surfaces are configured to slidably mate with each other. The laser body and the carrier body are configured to expose the laser output at the laser end when the one or more first mating surfaces and the one or more second mating surfaces slidably mate.

Dependencies are inferred from the claim text.