Method for III-V/silicon hybrid integration
AssigneeRockley Photonics Limited
InventorsGuomin Yu, Mohamad Dernaika, Ludovic Caro, Hua Yang, Aaron John Zilkie
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Abstract
A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.
Claims17
An optoelectronic device comprising:
- a precursor photonic device comprising:
- a substrate,
- a bonding region, for receiving and bonding to a transfer die, and
- a plurality of first alignment marks, for use in transfer printing, said first alignment marks being located in or adjacent to the bonding region and etched into the substrate;
- and
- a transfer die comprising:
- a photonic device, said photonic device having a bonding surface suitable for bonding to a precursor photonic device, and
- a plurality of second alignment marks, for use in a transfer-print process, wherein each of the plurality of second alignment marks of the transfer die is selected from two or more different types of alignment mark, and
- wherein the photonic device is an electro-absorption modulator, wherein said electro-absorption modulator comprises an input waveguide and an output waveguide, and wherein both of said input waveguide and said output waveguide comprise a port located on a same side of the transfer die.
An optoelectronic device comprising:
- a precursor photonic device comprising:
- a substrate;
- a bonding region, for receiving and bonding to a transfer die;
- and
- a plurality of alignment marks, for use in transfer printing, said alignment marks being located in or adjacent to the bonding region and etched into the substrate,
- wherein the optoelectronic device further comprises a transfer die comprising a photonic device, said photonic device having a bonding surface suitable for bonding to a precursor photonic device,
- wherein the transfer die includes a plurality of alignment marks, for use in a transfer-print process, wherein each of the plurality of alignment marks of the transfer die is selected from two or more different types of alignment marks, and
- wherein the alignment marks of the transfer die are voids in the transfer die which extend entirely through the transfer die.
Dependencies are inferred from the claim text.