System and method of packaging a laser/detector
AssigneeFinisar Corporation
InventorsJohn Ming-wei Chen, Robert K. Shih
Life of this patent
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AssigneeFinisar Corporation
InventorsJohn Ming-wei Chen, Robert K. Shih
Estimating the term…
The present invention relates generally to laser/detector packages, and particularly to laser/detector packages with components that increase the accuracy and ease of laser diode positioning. In particular, the laser/detector package of the present invention includes an attachment plate having a reference surface; a header post that is perpendicular to the reference surface when attached to the reference surface; sub-mount that houses a laser diode and abuts the reference surface or a spacer, which abuts the reference surface. By abutting the reference surface or the spacer, the laser diode attached to the sub-mount is easily and precisely positioned a proper distance from the reference surface. Additionally, preferred embodiments of the invention include a marking on the sub-mount that is parallel to the reference surface and a marking that is perpendicular to the reference surface on the spacer or sub-mount. These markings further improve the ease and accuracy of positioning and repositioning the laser diode and/or sub-mount.
A laser/detector package comprising:
A laser/detector package comprising:
A method of assembling a laser/detector package comprising:
A method of assembling a laser/detector package comprising:
Dependencies are inferred from the claim text.