Inphi Corporation
San Jose, CA, US· latest recorded location
INPHI CORPORATION is named on 534 US grants and 377 published applications in this corpus. Its most frequent classification is H04B (Transmission).
- Granted patents
- 534
- Published applications
- 377
- Inventors
- 246
- Granted in 2026 so far
- 0
- Most recent grant
- 31 Aug 2021
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 1 | 0 |
| 2004 | 4 | 0 |
| 2005 | 3 | 0 |
| 2006 | 2 | 0 |
| 2007 | 3 | 0 |
| 2008 | 4 | 0 |
| 2009 | 3 | 1 |
| 2010 | 0 | 1 |
| 2011 | 1 | 1 |
| 2012 | 3 | 0 |
| 2013 | 0 | 7 |
| 2014 | 19 | 8 |
| 2015 | 36 | 18 |
| 2016 | 55 | 33 |
| 2017 | 114 | 77 |
| 2018 | 113 | 75 |
| 2019 | 68 | 49 |
| 2020 | 74 | 62 |
| 2021 | 31 | 33 |
| 2022 | 0 | 12 |
By publication year.
Technology areas
Share of 911 documents
- H04BTransmission467
- H04LDigital communication418
- G02BOptical elements, systems or apparatus173
- H03MCoding147
- H03KPulse technique105
- G06FComputing and data processing101
- H04QSelecting72
- H04JMultiplex communication70
- H03LAutomatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or69
- H01SDevices using the process of light amplification by stimulated emission of radiation68
Recent patents
- Heatsink for co-packaged optical switch rack package31 Aug 2021US 11,109,515 B1
- TE polarizer based on SOI platform24 Aug 2021US 11,099,327 B2
- Silicon optical modulator, method for making the same10 Aug 2021US 11,086,189 B1
- Maximum likelihood error detection for decision feedback equalizers with PAM modulation15 Jun 2021US 11,038,538 B2
- Packaging of a directly modulated laser chip in photonics module18 May 2021US 11,011,886 B2
- Semiconductor package inhibiting viscous material spread27 Oct 2022US 2022/0344297 A1
- Methods for co-packaging optical modules on switch package substrate8 Sep 2022US 2022/0283360 A1
- Power monitor for silicon-photonics-based laser8 Sep 2022US 2022/0285906 A1
- High-power tunable laser on silicon photonics platform11 Aug 2022US 2022/0255295 A1
- Laser chip for flip-chip bonding on silicon photonics chips21 Apr 2022US 2022/0123518 A1
Most cited
By later US patents
- Programmable strength output buffer for RDIMM address register91US 7,307,863 B22007
- Output buffer with time varying source impedance for driving capacitively-terminated transmission lines87US 6,980,021 B12005
- Circuit and method for creating additional data transitions86US 9,973,329 B22018
- Master-slave flip-flop and clocking scheme81US 7,408,393 B12008
- Power management in semiconductor memory system56US 8,687,451 B22014