Packaging of a directly modulated laser chip in photonics module

A package structure of a directly modulated laser in a photonics module comprising:

• a substrate configured with a first surface including multiple conductor traces embedded therein and a second surface configured to be attached on a cool surface of a thermoelectric cooler including one or more conductor trances in the cool surface, the substrate having a cavity region formed from the first surface down to expose a portion of the cool a surface;
• a directly modulated laser (DML) chip having at least a first electrode attached to the one or more conductor traces in the cool surface within the cavity region and at least one second electrode positioned to be leveled with the first surface;
• and
• a driver chip flipped and disposed on the substrate, the driver chip including multiple electrodes configured to be coupled with the multiple conductor traces in the first surface and including at least one galvanically coupled output port to be coupled directly to the at least one second electrode of the DML chip.