Methods for co-packaging optical modules on switch package substrate

A co-packaged electro-optical module, comprising:

• a planar light circuit block optically coupled to a first set of optical fibers, the planar light circuit block configured to redirect light received from the first set of optical fibers in a first direction to light directed in a second direction that is different from the first direction;
• an edge coupling element coupled to a second set of optical fibers, the edge coupling element set apart from the planar light circuit block and configured to at least one of receive or transmit optical signals via the second set of optical fibers;
• and
• a silicon photonics chip having a surface and an edge, the silicon photonics chip being optically coupled to the planar light circuit block and to the edge coupling element, the silicon photonics chip being configured to:
• receive, via the planar light circuit block coupled to the surface, light that is received from the first set of optical fibers and directed by the planar light circuit block in the second direction;
• at least one of receive or transmit, via the edge coupling element coupled to the edge, the optical signals communicated using the second set of optical fibers;
• and
• electronically interface with one or more electronic components electrically coupled to the surface of the silicon photonics chip.

An electro-optical switching assembly, comprising

• a package substrate;
• a processor mounted on the package substrate, the processor configured to control switching among a plurality of optical channels;
• a first optical socket member coupled to the package substrate, the first optical socket member comprising a plurality of sockets;
• and
• a first plurality of co-packaged electro-optical modules mounted respectively in the plurality of sockets of the first optical socket member, the first plurality of co-packaged electro-optical modules optically coupled to a respective optical fiber and comprising a respective silicon photonics chip electrically coupled to the processor via the first optical socket member and the package substrate, wherein the first plurality of co-packaged electro-optical modules defines the plurality of optical channels controlled by the processor.