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US 2025/0138260 A1Published application
Self-aligned buried hetero structure laser structures and interposer
AssigneePOET Technologies, Inc.
InventorSURESH VENKATESAN
Life of this patent
Estimating the term…
Abstract
A method of forming an assembly that includes a laser die having alignment aids and an interposer having a plurality of cavities and alignment aids formed in the plurality of cavities. One or more laser die is positioned in one or more cavity on the interposer substrate and locally heated to bond each laser die to contacts in the cavities of the interposer. The interposer substrate and the plurality of laser die are then heated to move the one or more die to aligned positions within the respective cavities. Complementary alignment aids on the laser die and in the interposer cavities facilitate the alignment of the laser die into aligned positions.
Claims20
A method comprising
- placing and localized heating one or more devices in sequence,
- wherein placing a device of the one or more devices comprises placing a solder ball associated with the device to be in contact or in close proximity with a contact on a substrate, with the close proximity characterized as a separation that a melted contact is formed between the solder and the contact after the localized heating,
- wherein localized heating the placed device comprises heating in a vicinity of the solder ball to bond the device with the contact for affixing the device with the substrate;
- heating the substrate,
- wherein the substrate heating is configured to move the one or more devices to respective aligned positions.
2 more elements
A method comprising
- placing and localized heating one or more devices on a substrate in sequence,
- wherein placing a device of the one or more devices comprises
- placing the device on the substrate to align the device to an optical element of one or more optical elements on the substrate,
- wherein a first contact on the substrate associated with the optical element is placed into contact or in close proximity to a second contact of the device through a solder ball, with the solder ball coupled to the first contact or to the second contact,
- wherein the close proximity is characterized as a distance that a melted contact is formed between the first contact, the solder, and the second contact after the localized heating,
- wherein localized heating the placed device comprises
- heating in a vicinity of the solder ball,
- wherein the localized heating is configured to bond the second contact with the first contact through the solder ball for affixing the device with the substrate;
- heating the substrate,
- wherein the substrate heating is configured to move the one or more devices to respective aligned positions.
7 more elements
A method comprising
- providing a substrate,
- wherein the substrate comprises one or more first contacts,
- wherein the substrate comprises one or more optical elements, with each optical element of the one or more optical elements associated with a first contact of the one or more first contacts;
- providing one or more devices,
- wherein each device of the one or more devices comprises a second contact;
- placing and localized heating the one or more devices in sequence,
- wherein placing a device of the one or more devices comprises
- placing the device on the substrate to align the device to an optical element,
- wherein at least one of a first contact associated with the optical element or the second contact of the device is coupled to a solder ball,
- wherein the solder ball is in contact or in close proximity with the first or second contacts, with the close proximity characterized as a melted contact is formed between the first contact, the solder, and the second contact after the localized heating,
- wherein the device is at least partially align to the optical element,
- wherein localized heating the placed device comprises
- heating in a vicinity of the solder ball,
- wherein the localized heating is configured to bond the second contact with the first contact through the solder ball for affixing the device with the substrate;
- heating the substrate,
- wherein the substrate heating is configured to move the one or more devices to respective aligned positions.
13 more elements
Dependencies are inferred from the claim text.