H01S 5/0235
Method for mounting laser chips
H01S5/0235 (Method for mounting laser chips) appears on 1,726 US grants and 1,932 published applications in this corpus.
Search patents in H01S- Granted patents
- 1,726
- Published applications
- 1,932
- Assignees
- 613
- Inventors
- 3,342
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 4 | 0 |
| 1983 | 6 | 0 |
| 1984 | 6 | 0 |
| 1985 | 2 | 0 |
| 1986 | 5 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 8 | 0 |
| 1990 | 1 | 0 |
| 1991 | 8 | 0 |
| 1992 | 5 | 0 |
| 1993 | 8 | 0 |
| 1994 | 15 | 0 |
| 1995 | 11 | 0 |
| 1996 | 4 | 0 |
| 1997 | 10 | 0 |
| 1998 | 21 | 0 |
| 1999 | 23 | 0 |
| 2000 | 18 | 0 |
| 2001 | 27 | 15 |
| 2002 | 35 | 54 |
| 2003 | 36 | 60 |
| 2004 | 63 | 69 |
| 2005 | 51 | 77 |
| 2006 | 50 | 62 |
| 2007 | 40 | 70 |
| 2008 | 35 | 56 |
| 2009 | 38 | 61 |
| 2010 | 65 | 51 |
| 2011 | 49 | 60 |
| 2012 | 40 | 52 |
| 2013 | 48 | 56 |
| 2014 | 66 | 64 |
| 2015 | 67 | 72 |
| 2016 | 61 | 77 |
| 2017 | 62 | 79 |
| 2018 | 66 | 115 |
| 2019 | 107 | 130 |
| 2020 | 118 | 147 |
| 2021 | 85 | 109 |
| 2022 | 86 | 104 |
| 2023 | 72 | 117 |
| 2024 | 85 | 76 |
| 2025 | 48 | 63 |
| 2026 | 55 | 36 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Ensemble light source6 Oct 2026US 12,756,150 B1KYOCERA SLD Laser, Inc.
- Light-emitting device including semiconductor laser element encapsulated by base and cover with two lead terminals penetrating through lateral wall of base15 Sep 2026US 12,738,710 B2Nichia Corporation
- Laser light source and method of manufacturing the same1 Sep 2026US 12,725,999 B2Furukawa Electric Co., Ltd.
- Bonding device and bonding method1 Sep 2026US 12,726,000 B2Sumitomo Electric Industries, Ltd.
- Semiconductor device25 Aug 2026US 12,719,232 B2Denso Corporation
- Optoelectronic module and method for producing an optoelectronic module8 Oct 2026US 2026/0312360 A1ams-OSRAM International GmbH
- Substrate for mounting plurality of light sources, light source module, and exposure device1 Oct 2026US 2026/0302720 A1Nichia Corporation
- Light source module, optical engine, image display device, and method for manufacturing light source module1 Oct 2026US 2026/0302722 A1TDK Corporation
- Laser module, optical engine, and xr glasses10 Sep 2026US 2026/0269561 A1TDK Corporation
- Method for manufacturing light emitting device, bonding method, and light emitting device3 Sep 2026US 2026/0261092 A1Nichia Corporation
Most cited
By later US patents
- Method and system of heterogeneous substrate bonding for photonic integration168US 8,630,326 B2Skorpios Technologies, Inc. · 2014
- Method of making a mechanically compliant bump164US 6,458,411 B1Aralight, Inc. · 2002
- Method and system for heterogeneous substrate bonding of waveguide receivers164US 8,611,388 B2Skorpios Technologies, Inc. · 2013
- Methods for fabricating components with precise dimension control151US 8,288,204 B1Western Digital (Fremont), LLC · 2012
- Laser assisted transfer welding process144US 9,161,448 B2Semprius, Inc. · 2015