Semiconductor device
AssigneesDenso Corporation, Toyota Jidosha Kabushiki Kaisha, MIRISE Technologies Corporation
InventorNaoya Take
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a semiconductor element, a substrate, and a plurality of wires. The semiconductor element has a plurality of electrodes on a first surface. The substrate has an element mount portion to which a second surface of the semiconductor element is joined through a solder joining material, a plurality of bonding portions disposed on a periphery of the element mount portion and spaced apart from each other, and a solder absorption portion extending outwardly from the element mount portion to receive a surplus of the solder joining material and being electrically independent of the plurality of bonding portions. The wires connect the electrodes and the bonding portions. The element mount portion and the solder absorption portion have a higher solder wettability than another portion of the substrate.
Claims10
A semiconductor device comprising:
- a semiconductor element having a first surface and a second surface opposite to the first surface, the semiconductor element including a plurality of electrodes on the first surface;
- a substrate having:
- an element mount portion to which the second surface of the semiconductor element is joined through a solder joining material;
- a plurality of bonding portions disposed on a periphery of the element mount portion and spaced apart from each other;
- a solder absorption portion extending outwardly from the element mount portion to receive a surplus of the solder joining material and being electrically independent of the plurality of bonding portions;
- and
- a cover mount portion having a frame shape surrounding the periphery of the element mount portion and the plurality of bonding portions;
- a plurality of wires connecting the plurality of electrodes and the plurality of bonding portions;
- and
- a cover member disposed on the cover mount portion of the substrate and covering the semiconductor element and the plurality of wires while being spaced from the semiconductor element and the plurality of wires, wherein
- the element mount portion and the solder absorption portion have a higher solder wettability than another portion of the substrate,
- the semiconductor element is an optical semiconductor element,
- the cover member has a light transmission portion that allows a light to transmit at least at a part located above the semiconductor element,
- the solder absorption portion includes a frame part that extends from a side of the element mount portion and surrounds at least two of the plurality of bonding portions that are disposed along the side of the element mount portion at a location between the at least two of the plurality of bonding portions and the cover mount portion while being spaced apart from the at least two of the plurality of bonding portions and the cover mount portion.
Dependencies are inferred from the claim text.