Method and system for heterogeneous substrate bonding of waveguide receivers
AssigneeSkorpios Technologies, Inc.
InventorsStephen B. Krasulick, John Dallesasse
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Abstract
A composite integrated optical device includes a substrate including a silicon layer and a waveguide disposed in the silicon layer. The composite integrated optical device also includes an optical detector bonded to the silicon layer and a bonding region disposed between the silicon layer and the optical detector. The bonding region includes a metal-assisted bond at a first portion of the bonding region. The metal-assisted bond includes an interface layer positioned between the silicon layer and the optical detector. The bonding region also includes a direct semiconductor-semiconductor bond at a second portion of the bonding region.
Claims12
A composite integrated optical device comprising:
- a complementary metal oxide semiconductor (CMOS) substrate comprising a silicon layer;
- a waveguide disposed in the silicon layer;
- an optical detector bonded to the silicon layer comprising;
- and
- a bonding region disposed between the silicon layer and the optical detector, wherein the bonding region comprises:
- a metal-assisted bond at a first portion of the bonding region, wherein the metal-assisted bond includes an interface layer positioned between the silicon layer and the optical detector;
- and
- a direct semiconductor-semiconductor bond at a second portion of the bonding region.
Dependencies are inferred from the claim text.