Method of making a mechanically compliant bump
AssigneeAralight, Inc.
InventorsKeith W. Goossen, William Y. Jan
Life of this patent
Estimating the term…
Abstract
Mechanically compliant bumps for flip-chip bonding have a base that is deposited, for example, on the contact pad of a semiconductor chip. A thin wall depends from the periphery of the upper surface of base. The wall advantageously completely encircles the upper surface of the mechanically compliant bump. The wall, which is capable of flexing or deforming under pressure provides mechanical compliance. The wall is able to flex or deform under pressure even if the bump is formed from high-temperature metal. These mechanically compliant bumps facilitate sound electrical connections even when an electronics device is brought into contact for bonding out of parallel.
Claims18
A method comprising:
- forming openings in a layer of photoresist that is disposed on a surface of a first electronics device, wherein a width of said opening increases with increasing distance from said surface, the increasing width defining a taper, said taper characterized by a taper angle between about five degrees and about thirty degrees;
- depositing metal in said openings to form, in each said opening, a solid base and a wall depending from a periphery of an upper surface of said base;
- and
- removing said layer of photoresist.
A method comprising:
- forming openings in a layer that is disposed on a semiconductor, wherein said openings have a reverse taper;
- and
- depositing metal in said openings to form, in each said opening, a solid base and a wall depending from a periphery of an upper surface of said base, wherein said solid base and said wall have said reverse taper.
Dependencies are inferred from the claim text.