Method for manufacturing light emitting device, bonding method, and light emitting device

A light emitting device comprising:

• a base member including a first upper surface and a second upper surface located above the first upper surface;
• one or more semiconductor laser elements disposed on the first upper surface;
• a lid member including a lower surface bonded to the second upper surface;
• and
• a bonding member that contacts the base member and the lid member and has a thickness of at least 15 μm and less than 40 μm between the base member and the lid member, the bonding member being a brazing material that has been solidified in a state of bonding the base member and the lid member, wherein
• the second upper surface of the base member is a flat surface,
• the lower surface of the lid member is a flat surface,
• the bonding member includes a region disposed on the second upper surface, the region protruding outward beyond an outer edge of the lid member in top view, and
• a space in which the one or more semiconductor laser elements are disposed is sealed.

A light emitting device comprising:

• a base member including a first upper surface and a second upper surface located above the first upper surface;
• one or more semiconductor laser elements disposed on the first upper surface;
• a lid member including a lower surface bonded to the second upper surface;
• and
• a bonding member that contacts the base member and the lid member and has a thickness of at least 15 μm and less than 40 μm between the base member and the lid member, the bonding member being a paste material that has been solidified in a state of bonding the base member and the lid member, wherein
• the second upper surface of the base member is a flat surface,
• the lower surface of the lid member is a flat surface,
• the bonding member includes a region disposed on the second upper surface, the region protruding outward beyond an outer edge of the lid member in top view, and
• a space in which the one or more semiconductor laser elements are disposed is sealed.