Methods for fabricating components with precise dimension control
AssigneeWestern Digital (Fremont), LLC
InventorsLei Wang, Zongrong Liu
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AssigneeWestern Digital (Fremont), LLC
InventorsLei Wang, Zongrong Liu
Estimating the term…
Methods for fabricating components with precise dimension control are described. One such method includes providing a workpiece including a top layer and a bottom layer of silicon separated by a layer of SiOx, where each of the three layers has about the same length and width, removing edge portions of the top layer, thereby exposing portions of the SiOx layer, etching the exposed portions of the SiOx layer and portions of the SiOx layer disposed between the top layer and bottom layer, thereby forming undercut sections between the top layer and bottom layer, growing a second layer of SiOx having a preselected thickness on the workpiece, depositing metal on the workpiece such that the metal deposited on the top layer is not continuous with the metal deposited on the bottom layer, and removing the bottom layer and a portion of the SiOx layer having a preselected thickness.
A method for fabricating silicon components with precise dimension control, the process comprising:
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