H01J 37/32871
Means for trapping or directing unwanted particles
Official title: {Means for trapping or directing unwanted particles}
H01J37/32871 (Means for trapping or directing unwanted particles) appears on 210 US grants and 217 published applications in this corpus.
Search patents in H01J- Granted patents
- 210
- Published applications
- 217
- Assignees
- 109
- Inventors
- 664
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 6 | 0 |
| 1996 | 6 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 7 | 0 |
| 2000 | 14 | 0 |
| 2001 | 10 | 3 |
| 2002 | 12 | 9 |
| 2003 | 13 | 3 |
| 2004 | 6 | 4 |
| 2005 | 3 | 5 |
| 2006 | 2 | 3 |
| 2007 | 0 | 5 |
| 2008 | 0 | 4 |
| 2009 | 2 | 4 |
| 2010 | 3 | 6 |
| 2011 | 2 | 8 |
| 2012 | 4 | 5 |
| 2013 | 1 | 6 |
| 2014 | 2 | 11 |
| 2015 | 4 | 9 |
| 2016 | 9 | 18 |
| 2017 | 11 | 19 |
| 2018 | 8 | 18 |
| 2019 | 7 | 10 |
| 2020 | 9 | 9 |
| 2021 | 9 | 9 |
| 2022 | 5 | 12 |
| 2023 | 12 | 12 |
| 2024 | 6 | 5 |
| 2025 | 13 | 11 |
| 2026 | 7 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Flow control arrangements, semiconductor processing systems having flow control arrangements, and flow control methods6 Oct 2026US 12,753,499 B2ASM IP Holding B. V.
- Substrate processing system and particle removal method1 Sep 2026US 12,725,769 B2Tokyo Electron Limited
- Passivation chemistry for plasma etching9 Jun 2026US 12,651,728 B2Lam Research Corporation
- Cross flow gas delivery for particle reduction9 Jun 2026US 12,651,731 B2APPLIED Materials.Inc.
- Method for treating substrate using boron compound26 May 2026US 12,642,032 B2Tes Co., Ltd
- Fluid dispensing system and method24 Sep 2026US 2026/0290766 A1ASML Netherlands B. V.
- Radio frequency (rf) choke for particle reduction and increased conductance in preclean chamber13 Aug 2026US 2026/0237606 A1APPLIED Materials.Inc.
- Components and processes for managing plasma process byproduct materials23 Jul 2026US 2026/0213142 A1Lam Research Corporation
- Contaminant removal device for arc reaction chamber and method thereof25 Jun 2026US 2026/0179890 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Particle contamination control in a plasma afterglow7 May 2026US 2026/0128264 A1University of Iowa Research Foundation
Most cited
By later US patents
- Method of operating a dual chamber reactor with neutral density decoupled from ion density606US 6,635,578 B1APPLIED Materials.Inc. · 2003
- High selectivity etch using an external plasma discharge503US 6,074,514 AAPPLIED Materials.Inc. · 2000
- Substrate cleaning chamber and components488US 7,942,969 B2APPLIED Materials.Inc. · 2011
- Vacuum processing chamber having multi-mode access485US 6,095,083 AApplied Materiels, Inc. · 2000
- Plasma assisted processing chamber with separate control of species density442US 6,352,049 B1APPLIED Materials.Inc. · 2002