H01J 37/32559
Protection means
Official title: {Protection means, e.g. coatings}
H01J37/32559 (Protection means) appears on 229 US grants and 257 published applications in this corpus.
Search patents in H01J- Granted patents
- 229
- Published applications
- 257
- Assignees
- 132
- Inventors
- 687
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 7 | 0 |
| 2000 | 7 | 0 |
| 2001 | 6 | 5 |
| 2002 | 4 | 4 |
| 2003 | 4 | 16 |
| 2004 | 6 | 5 |
| 2005 | 6 | 5 |
| 2006 | 3 | 5 |
| 2007 | 3 | 6 |
| 2008 | 2 | 12 |
| 2009 | 3 | 9 |
| 2010 | 5 | 12 |
| 2011 | 3 | 7 |
| 2012 | 5 | 2 |
| 2013 | 5 | 6 |
| 2014 | 4 | 15 |
| 2015 | 9 | 13 |
| 2016 | 9 | 11 |
| 2017 | 10 | 11 |
| 2018 | 7 | 11 |
| 2019 | 6 | 10 |
| 2020 | 9 | 13 |
| 2021 | 15 | 24 |
| 2022 | 12 | 17 |
| 2023 | 19 | 11 |
| 2024 | 10 | 9 |
| 2025 | 13 | 9 |
| 2026 | 7 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Control of plasma sheath with bias supplies4 Aug 2026US 12,700,569 B2Advanced Energy Industries, Inc.
- Arc-beam scanning for suppressing anode overgrowth in PICVD system19 May 2026US 12,633,502 B2Oerlikon Surface Solutions AG, PfäFfikon
- Substrate treating apparatus12 May 2026US 12,626,890 B2Semes Co., Ltd.
- Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium14 Apr 2026US 12,603,253 B2Kokusai Electric Corporation
- Electrode fixing assembly and dry etching device24 Mar 2026US 12,586,766 B2Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Sputtering apparatus and method of manufacturing semiconductor device20 Aug 2026US 2026/0245836 A1Mitsubishi Electric Corporation
- Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording medium30 Jul 2026US 2026/0221392 A1Kokusai Electric Corporation
- Substrate processing apparatus and substrate processing method11 Jun 2026US 2026/0162943 A1Semes Co., Ltd.
- Shaped ion blocker plate for indirect ccp16 Apr 2026US 2026/0106108 A1APPLIED Materials.Inc.
- Vertical plasma source12 Mar 2026US 2026/0074158 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Plasma processing apparatus with insulated gas inlet pore426US 7,712,435 B2ASM Japan K .K. · 2010
- High density plasma process chamber146US 6,095,084 AAPPLIED Materials.Inc. · 2000
- Ceramic protection for heated metal surfaces of plasma processing chamber exposed to chemically aggressive gaseous environment therein and method of protecting such heated metal surfaces117US 5,680,013 AAPPLIED Materials.Inc. · 1997
- Removable liner design for plasma immersion ion implantation95US 6,120,660 ASilicon Genesis Corporation · 2000
- Plasma reactor for the treatment of large size substrates77US 6,228,438 B1Unakis Balzers Aktiengesellschaft · 2001