Substrate treating apparatus

A substrate treating apparatus comprising:

• a chamber having a treating space therein;
• a support unit disposed within the treating space and configured to support a substrate;
• and
• a plasma generation unit configured to generate a plasma from a process gas supplied to the treating space,
• wherein the plasma generation unit comprises:
• a bottom electrode member;
• and
• a top electrode member opposite to the bottom electrode member,
• wherein the top electrode member comprises:
• an electrode plate having a convex top surface and including an electrode;
• a first plate made of a different material from the electrode plate;
• and
• a second plate,
• wherein the second plate, the electrode plate, and the first plate are stacked on one another,
• wherein the second plate is adjacent to the treating space of the chamber,
• wherein the electrode plate is disposed in a space between a top surface of the second plate and a bottom surface of the first plate,
• wherein a first thickness of a center part of the top electrode member relative to a flat bottom surface of the top electrode member and a second thickness of an edge part of the top electrode member relative to the flat bottom surface of the top electrode member are different, and
• wherein a difference between the first thickness and the second thickness is 500% or less of the second thickness or 500% or less of the first thickness.