H01J 37/32513
Sealing means
Official title: {Sealing means, e.g. sealing between different parts of the vessel}
H01J37/32513 (Sealing means) appears on 251 US grants and 416 published applications in this corpus.
Search patents in H01J- Granted patents
- 251
- Published applications
- 416
- Assignees
- 108
- Inventors
- 975
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 2 |
| 2008 | 0 | 5 |
| 2009 | 0 | 3 |
| 2010 | 1 | 1 |
| 2011 | 7 | 5 |
| 2012 | 1 | 10 |
| 2013 | 4 | 8 |
| 2014 | 3 | 12 |
| 2015 | 7 | 30 |
| 2016 | 15 | 38 |
| 2017 | 13 | 31 |
| 2018 | 24 | 33 |
| 2019 | 27 | 35 |
| 2020 | 31 | 23 |
| 2021 | 21 | 23 |
| 2022 | 17 | 35 |
| 2023 | 16 | 35 |
| 2024 | 27 | 34 |
| 2025 | 22 | 29 |
| 2026 | 15 | 22 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Seal structure, substrate processing apparatus, substrate processing method and method of manufacturing semiconductor device15 Sep 2026US 12,738,461 B2Kokusai Electric Corporation
- Plasma processing apparatus and plasma processing method8 Sep 2026US 12,729,440 B2Tokyo Electron Limited
- Plasma measuring method and plasma processing apparatus8 Sep 2026US 12,731,772 B2Tokyo Electron Limited
- Light emitting sealed body, light emitting unit, and light source device1 Sep 2026US 12,725,764 B2Energetiq Technology, Inc.
- Surface treatment apparatus and surface treatment method11 Aug 2026US 12,703,908 B2Shibaura Machine Co., Ltd.
- Plasma treatment vessel and plasma treatment device17 Sep 2026US 2026/0279737 A1Plasmapp Co., Ltd.
- Reaction chamber and wafer etching device10 Sep 2026US 2026/0269187 A1Beijing E-Town Semiconductor Technology Co., Ltd.
- Ultra High Purity Conditions for Atomic Scale Processing27 Aug 2026US 2026/0253839 A1Kurt J. Lesker Company
- Pedestal assembly27 Aug 2026US 2026/0255929 A1Lam Research Corporation
- Isolation valve gasket13 Aug 2026US 2026/0237611 A1Lam Research Corporation
Most cited
By later US patents
- Technique to deposit sidewall passivation for high aspect ratio cylinder etch440US 9,997,373 B2Lam Research Corporation · 2018
- Multi-zone reactor, system including the reactor, and method of using the same418US 10,276,355 B2ASM IP Holding B. V. · 2019
- Plasma processing apparatus347US 10,622,196 B2Tokyo Electron Limited · 2020
- Method for depositing metals free ald silicon nitride films using halide-based precursors346US 9,824,884 B1Lam Research Corporation · 2017
- Method and apparatus for backside deposition reduction by control of wafer support to achieve edge seal336US 9,428,833 B1Lam Research Corporation · 2016