Reaction chamber and wafer etching device

A wafer etching device comprising:

• a reaction chamber, comprising:
• a chamber body comprising a top plate and a bottom plate disposed oppositely in a vertical direction, wherein the top plate is provided with an inlet port, the bottom plate is provided with a pumping port, a wafer stage is provided between the inlet port and the pumping port, and a pumping region is formed between an inner wall of the chamber body and the wafer stage;
• a first support part disposed between the inner wall of the chamber body and the wafer stage;
• and
• a pumping part comprising a valve plate and a valve core, wherein the valve plate is disposed inside the chamber body and connected to a first end of the valve core, a second end of the valve core is liftably inserted into the pumping port, and when the valve core is in a first working position, a first annulus is formed between the valve plate and the bottom plate;
• and a second annulus is formed between the valve core and the pumping port;
• wherein the first annulus, the second annulus, and the pumping region are disposed coaxially.