H01J 37/32422
Arrangement for selecting ions or species in the plasma
Official title: {Arrangement for selecting ions or species in the plasma}
H01J37/32422 (Arrangement for selecting ions or species in the plasma) appears on 617 US grants and 865 published applications in this corpus.
Search patents in H01J- Granted patents
- 617
- Published applications
- 865
- Assignees
- 215
- Inventors
- 1,618
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 6 | 0 |
| 1999 | 5 | 0 |
| 2000 | 6 | 0 |
| 2001 | 5 | 5 |
| 2002 | 14 | 4 |
| 2003 | 4 | 4 |
| 2004 | 1 | 3 |
| 2005 | 6 | 9 |
| 2006 | 3 | 9 |
| 2007 | 1 | 14 |
| 2008 | 6 | 10 |
| 2009 | 2 | 11 |
| 2010 | 8 | 19 |
| 2011 | 7 | 18 |
| 2012 | 3 | 29 |
| 2013 | 18 | 29 |
| 2014 | 23 | 46 |
| 2015 | 34 | 57 |
| 2016 | 48 | 66 |
| 2017 | 41 | 60 |
| 2018 | 40 | 50 |
| 2019 | 54 | 56 |
| 2020 | 40 | 54 |
| 2021 | 43 | 54 |
| 2022 | 32 | 45 |
| 2023 | 33 | 58 |
| 2024 | 35 | 53 |
| 2025 | 46 | 55 |
| 2026 | 25 | 47 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Pulsing remote plasma for ion damage reduction and etch uniformity improvement26 May 2026US 12,640,348 B2Lam Research Corporation
- Method and apparatus for generating plasma with ion blocker plate26 May 2026US 12,640,349 B2APPLIED Materials.Inc.
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- Method and apparatus for generating plasma with ion blocker plate3 Sep 2026US 2026/0260849 A1APPLIED Materials.Inc.
- Method of treating substrate including identifying condition of substrate13 Aug 2026US 2026/0237612 A1Semes Co., Ltd.
- Systems and methods for metastable activated radical selective strip and etch using dual plenum showerhead6 Aug 2026US 2026/0231715 A1Lam Research Corporation
- Methods and systems for dry etching30 Jul 2026US 2026/0221390 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of operating a dual chamber reactor with neutral density decoupled from ion density606US 6,635,578 B1APPLIED Materials.Inc. · 2003
- Methods for etch of metal and metal-oxide films564US 9,064,815 B2APPLIED Materials.Inc. · 2015
- Oxide and metal removal562US 9,309,598 B2APPLIED Materials.Inc. · 2016
- Method and systems for in-situ formation of intermediate reactive species486US 9,589,770 B2ASM IP Holding B. V. · 2017
- Pulsed remote plasma method and system476US 9,484,191 B2ASM IP Holding B. V. · 2016