H01J 2237/3365
Plasma source implantation
H01J2237/3365 (Plasma source implantation) appears on 43 US grants and 59 published applications in this corpus.
Search patents in H01J- Granted patents
- 43
- Published applications
- 59
- Assignees
- 19
- Inventors
- 141
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2010 | 0 | 2 |
| 2011 | 0 | 0 |
| 2012 | 0 | 3 |
| 2013 | 1 | 1 |
| 2014 | 3 | 5 |
| 2015 | 3 | 7 |
| 2016 | 6 | 9 |
| 2017 | 9 | 6 |
| 2018 | 6 | 7 |
| 2019 | 3 | 1 |
| 2020 | 2 | 4 |
| 2021 | 1 | 0 |
| 2022 | 3 | 1 |
| 2023 | 1 | 0 |
| 2024 | 0 | 4 |
| 2025 | 3 | 4 |
| 2026 | 2 | 5 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- RF blocker for uniformity control18 Aug 2026US 12,712,160 B2APPLIED Materials.Inc.
- Target processing device and target processing method7 Jul 2026US 12,676,292 B2Kioxia Corporation
- System and method for ion source temperature control using symmetric or asymmetric application of force18 Nov 2025US 12,476,087 B2APPLIED Materials.Inc.
- Shield ring mounting using compliant hardware12 Aug 2025US 12,387,912 B2APPLIED Materials.Inc.
- Plasma ion processing of substrates25 Feb 2025US 12,237,150 B2Lifehouse Australia AS Trustee for the Lifehouse Australia Trust
- Rf blocker for uniformity control17 Sep 2026US 2026/0279740 A1APPLIED Materials.Inc.
- Apparatus for manufacturing semiconductor structures and method for manufacturing semiconductor structures10 Sep 2026US 2026/0269189 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus for Extracting Low Energy Ion Beam30 Jul 2026US 2026/0221394 A1
- Doped silicon or boron layer formation26 Mar 2026US 2026/0090294 A1Lam Research Corporation
- Multi-plenum gas manifolds for substrate processing systems15 Jan 2026US 2026/0018383 A1Lam Research Corporation
Most cited
By later US patents
- Plasma activated conformal dielectric film deposition97US 8,637,411 B2Novellus Systems, Inc. · 2014
- Plasma activated conformal dielectric film deposition56US 8,999,859 B2Novellus Systems, Inc. · 2015
- Plasma activated conformal dielectric film deposition30US 9,570,274 B2Novellus Systems, Inc. · 2017
- Plasma activated conformal dielectric film deposition28US 10,043,655 B2Novellus Systems, Inc. · 2018
- Method for ion implant using grid assembly10US 8,697,552 B2Intevac, Inc. · 2014