H01J 2237/2816
Length
H01J2237/2816 (Length) appears on 92 US grants and 91 published applications in this corpus.
Search patents in H01J- Granted patents
- 92
- Published applications
- 91
- Assignees
- 28
- Inventors
- 181
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 8 |
| 2003 | 4 | 4 |
| 2004 | 1 | 2 |
| 2005 | 4 | 6 |
| 2006 | 8 | 6 |
| 2007 | 7 | 9 |
| 2008 | 8 | 19 |
| 2009 | 6 | 6 |
| 2010 | 8 | 1 |
| 2011 | 7 | 4 |
| 2012 | 4 | 2 |
| 2013 | 3 | 1 |
| 2014 | 4 | 5 |
| 2015 | 1 | 1 |
| 2016 | 5 | 2 |
| 2017 | 2 | 0 |
| 2018 | 0 | 2 |
| 2019 | 2 | 3 |
| 2020 | 3 | 2 |
| 2021 | 3 | 3 |
| 2022 | 1 | 3 |
| 2023 | 2 | 0 |
| 2024 | 1 | 2 |
| 2025 | 1 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Scanning electron microscope (SEM) measurement method and apparatus26 May 2026US 12,640,340 B2Samsung Electronics Co., Ltd.
- Charged particle beam device and inspection device25 Feb 2025US 12,237,145 B2Hitachi High-Tech Corporation
- Inspection apparatus adjustment system and inspection apparatus adjustment method13 Feb 2024US 11,898,968 B2Hitachi High-Tech Corporation
- Electron beam observation device, electron beam observation system, and image correcting method and method for calculating correction factor for image correction in electron beam observation device17 Oct 2023US 11,791,130 B2Hitachi High-Tech Corporation
- Substrate and method for calibration of measurement apparatus10 Jan 2023US 11,549,807 B2Kioxia Corporation
- Charged particle beam device and inspection device5 Sep 2024US 2024/0297012 A1Hitachi High-Tech Corporation
- Scanning electron microscope (sem) measurement method and apparatus7 Mar 2024US 2024/0079206 A1Samsung Electronics Co., Ltd.
- Inspection Apparatus Adjustment System and Inspection Apparatus Adjustment Method11 Aug 2022US 2022/0252525 A1Hitachi High-Tech Corporation
- Electron Beam Observation Device, Electron Beam Observation System, and Image Correcting Method and Method for Calculating Correction Factor for Image Correction in Electron Beam Observation Device17 Feb 2022US 2022/0051868 A1Hitachi High-Tech Corporation
- Optical devices and method of optical device metrology20 Jan 2022US 2022/0018792 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Method for inspecting substrate, substrate inspecting system and electron beam apparatus113US 7,109,483 B2Ebara Corporation · 2006
- Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using former61US 6,855,929 B2Ebara Corporation · 2005
- Electron beam apparatus and method of manufacturing semiconductor device using the apparatus56US 6,593,152 B2Ebara Corporation · 2003
- Electron beam apparatus and device fabrication method using the electron beam apparatus43US 7,244,932 B2Ebara Corporation · 2007
- Inspection system by charged particle beam and method of manufacturing devices using the system41US 7,601,972 B2Ebara Corporation · 2009