H01J 2237/2814
Measurement of surface topography
H01J2237/2814 (Measurement of surface topography) appears on 352 US grants and 367 published applications in this corpus.
Search patents in H01J- Granted patents
- 352
- Published applications
- 367
- Assignees
- 79
- Inventors
- 664
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 4 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 0 |
| 2002 | 5 | 11 |
| 2003 | 12 | 11 |
| 2004 | 10 | 17 |
| 2005 | 13 | 26 |
| 2006 | 18 | 18 |
| 2007 | 20 | 18 |
| 2008 | 21 | 28 |
| 2009 | 10 | 9 |
| 2010 | 16 | 5 |
| 2011 | 15 | 11 |
| 2012 | 9 | 8 |
| 2013 | 8 | 8 |
| 2014 | 12 | 14 |
| 2015 | 12 | 19 |
| 2016 | 15 | 9 |
| 2017 | 13 | 12 |
| 2018 | 7 | 10 |
| 2019 | 18 | 23 |
| 2020 | 24 | 22 |
| 2021 | 19 | 23 |
| 2022 | 19 | 20 |
| 2023 | 11 | 11 |
| 2024 | 12 | 14 |
| 2025 | 10 | 10 |
| 2026 | 5 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Precision in stereoscopic measurements using a pre-deposition layer28 Jul 2026US 12,695,054 B2Applied Materials Israel Ltd.
- System and method for generating and analyzing roughness measurements and their use for process monitoring and control23 Jun 2026US 12,665,160 B2Fractilia, LLC
- Screening edge placement uniformity wafer stochastics26 May 2026US 12,640,338 B2KLA Corporation
- Scanning electron microscope (SEM) measurement method and apparatus26 May 2026US 12,640,340 B2Samsung Electronics Co., Ltd.
- Structure estimation system and structure estimation program for estimating height of structure based on data from charged particle beam device24 Feb 2026US 12,561,823 B2Hitachi High-Tech Corporation
- Method for operating a particle beam device, and particle beam device17 Sep 2026US 2026/0279722 A1
- Method of Dispositioning and Control of a Semiconductor Manufacturing Process10 Sep 2026US 2026/0269176 A1Fractilia, LLC
- Method of Dispositioning and Control of a Semiconductor Manufacturing Process27 Aug 2026US 2026/0253833 A1Fractilia, LLC
- Scanning electron microscope and photomultiplier therefor and method of evaluating a sample27 Aug 2026US 2026/0253835 A1Applied Materials Israel Ltd.
- Structure Estimation System and Structure Estimation Program for Estimating Height of Structure Based on Data from Charged Particle Beam Device4 Jun 2026US 2026/0154838 A1Hitachi High-Tech Corporation
Most cited
By later US patents
- Method for inspecting substrate, substrate inspecting system and electron beam apparatus113US 7,109,483 B2Ebara Corporation · 2006
- Structure and method for determining a defect in integrated circuit manufacturing process81US 8,754,372 B2Hermes Microvision, Inc. · 2014
- Focused ion beam metrology75US 5,798,529 AInternational Business Machines Corporation · 1998
- Electron beam exposure or system inspection or measurement apparatus and its method and height detection apparatus74US 6,107,637 AHitachi, Ltd. · 2000
- Image-formation apparatus using charged particle beams under various focus conditions68US 6,538,249 B1Hitachi, Ltd. · 2003