H01J 2237/2815
Depth profile
H01J2237/2815 (Depth profile) appears on 75 US grants and 77 published applications in this corpus.
Search patents in H01J- Granted patents
- 75
- Published applications
- 77
- Assignees
- 24
- Inventors
- 187
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 1 |
| 2003 | 3 | 5 |
| 2004 | 4 | 4 |
| 2005 | 5 | 4 |
| 2006 | 3 | 4 |
| 2007 | 2 | 2 |
| 2008 | 2 | 2 |
| 2009 | 2 | 1 |
| 2010 | 3 | 0 |
| 2011 | 0 | 1 |
| 2012 | 2 | 1 |
| 2013 | 1 | 3 |
| 2014 | 2 | 1 |
| 2015 | 2 | 4 |
| 2016 | 5 | 4 |
| 2017 | 6 | 5 |
| 2018 | 3 | 2 |
| 2019 | 2 | 6 |
| 2020 | 7 | 6 |
| 2021 | 5 | 6 |
| 2022 | 6 | 3 |
| 2023 | 3 | 5 |
| 2024 | 3 | 3 |
| 2025 | 3 | 3 |
| 2026 | 1 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Precision in stereoscopic measurements using a pre-deposition layer28 Jul 2026US 12,695,054 B2Applied Materials Israel Ltd.
- Flow for high resolution stereoscopic measurements21 Oct 2025US 12,451,323 B2Applied Materials Israel Ltd.
- Pattern height metrology using an e-beam system15 Apr 2025US 12,278,086 B2Imec Vzw
- Method, apparatus, and program for determining condition related to captured image of charged particle beam apparatus4 Mar 2025US 12,243,711 B2Hitachi High-Tech Corporation
- Pattern measurement device and pattern measurement method24 Dec 2024US 12,174,551 B2Hitachi High-Technologies Corporation
- Analysis System and Particle Analysis Method16 Apr 2026US 2026/0106106 A1Hitachi High-Tech Corporation
- Pattern Measurement Method, Measurement System, and Computer-Readable Medium23 Oct 2025US 2025/0327663 A1Hitachi High-Tech Corporation
- Pattern Measurement Device and Pattern Measurement Method20 Feb 2025US 2025/0060678 A1Hitachi High-Tech Corporation
- Method to more precisely calibrate the mechanical tilt and rotation angles of an sem column13 Feb 2025US 2025/0054726 A1Applied Materials Israel Ltd.
- Flow for high resolution stereoscopic measurements10 Oct 2024US 2024/0339289 A1Applied Materials Israel Ltd.
Most cited
By later US patents
- Image-formation apparatus using charged particle beams under various focus conditions68US 6,538,249 B1Hitachi, Ltd. · 2003
- Method and apparatus for measuring thickness of thin film46US 6,683,308 B2Fab Solutions, Inc. · 2004
- Dual electron beam instrument for multi-perspective18US 6,812,462 B1KLA-Tencor Technologies Corporation · 2004
- Combination laser and charged particle beam system17US 8,314,410 B2FEI Company · 2012
- Charged particle beam apparatus11US 6,653,633 B2Hitachi, Ltd. · 2003