Method of Dispositioning and Control of a Semiconductor Manufacturing Process

An apparatus comprising:

• measure corresponding physical characteristics of a plurality of semiconductor features on one or more wafers produced using a semiconductor manufacturing process;
• and
• an information system configured to:
• estimate a mean and a variance using the corresponding physical characteristics;
• combine the mean and the variance to generate a combined mean and variance;
• predict, using the combined mean and variance, a proportion of manufacturing excursions or failures at multiple die locations;
• predict, using the proportion of manufacturing excursions or failures at the multiple die locations, a failure probability of a die produced with the semiconductor manufacturing process;
• and
• adjust the semiconductor manufacturing process based on the failure probability.

A tangible non-transitory computer-readable storage medium having program instructions stored therein that, in response to execution by a computer system, causes the computer system to perform operations comprising:

• measuring corresponding physical characteristics of a plurality of semiconductor features on one or more wafers produced using a semiconductor manufacturing process;
• estimating a mean and a variance using the corresponding physical characteristics;
• combining the mean and the variance to generate a combined mean and variance;
• predicting, using the combined mean and variance, a proportion of manufacturing excursions or failures at multiple die locations;
• predicting, using the proportion of manufacturing excursions or failures at the multiple die locations, a failure probability of a die produced with the semiconductor manufacturing process;
• and
• adjusting the semiconductor manufacturing process based on the failure probability.