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AssigneeHitachi High-Tech Corporation
InventorsTaichi Maeda, Yuko Sasaki
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Disclosed is a solution for quickly specifying an optical condition of a wafer to be inspected, and in particular, accelerating optical condition setting after obtaining a customer wafer. An inspection apparatus automatic adjustment system according to the present invention includes an analysis-condition-setting interface that inputs analysis conditions; an analysis-execution unit that performs analysis; an inspection-device model and model DB used for analysis; an analysis-result DB that stores analysis results; an observation-condition setting interface that inputs a wafer pattern, a focus point, an optimization index, and a priority; a wafer-pattern search unit that searches for a wafer pattern similar to the input wafer pattern; an optical-condition-extraction unit that extracts, from the analysis result DB, the optimum optical condition for the similar wafer pattern and the focus point; and an optical-condition-setting unit that generates a control signal corresponding to the optical condition and transmits the control signal to the inspection apparatus.
An inspection apparatus adjustment system that adjusts an inspection apparatus which inspects samples,
An inspection apparatus adjustment method using an inspection apparatus adjustment system that adjusts an inspection apparatus which inspects samples,
An inspection apparatus that inspects samples,
Dependencies are inferred from the claim text.