Loading patent…
AssigneeHitachi High-Tech Corporation
InventorsTaichi MAEDA, Yuko SASAKI
Estimating the term…
The present invention addresses the problem of quickly specifying an optical condition of a wafer to be inspected, and in particular, accelerating optical condition setting after obtaining a customer wafer. An inspection apparatus automatic adjustment system according to the present invention comprises: an analysis condition setting interface 102 which inputs analysis conditions; an analysis execution unit 103 which performs analysis; an inspection device model and model DB 101 used for analysis; an analysis result DB 104 that stores analysis results; an observation condition setting interface 105 which inputs a wafer pattern, a focus point, an optimization index, and a priority; a wafer pattern search unit 106 which searches for a wafer pattern similar to the input wafer pattern; an optical condition extraction unit 107 which extracts, from the analysis result DB 104, the optimum optical condition for the similar wafer pattern and the focus point; and an optical condition setting unit 108 which generates a control signal corresponding to the optical condition and transmits the control signal to the inspection apparatus.
-15. (canceled)
An inspection apparatus adjustment system that adjusts an inspection apparatus which inspects samples,
An inspection apparatus adjustment method using an inspection apparatus adjustment system that adjusts an inspection apparatus which inspects samples,
An inspection apparatus that inspects samples,
Dependencies are inferred from the claim text.