H01J 2237/24564
Measurements of electric or magnetic variables
Official title: Measurements of electric or magnetic variables, e.g. voltage, current, frequency
H01J2237/24564 (Measurements of electric or magnetic variables) appears on 412 US grants and 560 published applications in this corpus.
Search patents in H01J- Granted patents
- 412
- Published applications
- 560
- Assignees
- 130
- Inventors
- 1,187
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 10 |
| 2003 | 5 | 3 |
| 2004 | 2 | 5 |
| 2005 | 5 | 7 |
| 2006 | 9 | 8 |
| 2007 | 8 | 10 |
| 2008 | 14 | 26 |
| 2009 | 9 | 19 |
| 2010 | 14 | 11 |
| 2011 | 17 | 8 |
| 2012 | 9 | 7 |
| 2013 | 8 | 5 |
| 2014 | 13 | 13 |
| 2015 | 5 | 8 |
| 2016 | 9 | 6 |
| 2017 | 8 | 11 |
| 2018 | 11 | 18 |
| 2019 | 15 | 23 |
| 2020 | 23 | 44 |
| 2021 | 25 | 54 |
| 2022 | 42 | 29 |
| 2023 | 30 | 71 |
| 2024 | 28 | 65 |
| 2025 | 52 | 52 |
| 2026 | 44 | 46 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Wave-assisted hybrid plasma source8 Oct 2026US 2026/0311966 A1Tokyo Electron Limited
- System and Method for Extending Faraday Setup Cup Life Time by Scanning Ion Beam during Setup1 Oct 2026US 2026/0302125 A1APPLIED Materials.Inc.
- Method, apparatus and system for characterizing energetic neutral component of a particle beam24 Sep 2026US 2026/0290741 A1Axcelis Technologies, Inc.
- System and method for non-invasive sensing of radio-frequency current spectra flowing in a plasma processing chamber10 Sep 2026US 2026/0266880 A1APPLIED Materials.Inc.
Most cited
By later US patents
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- E-beam inspection apparatus and method of using the same on various integrated circuit chips76US 9,496,119 B1PDF Solutions, Inc. · 2016
- Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using former61US 6,855,929 B2Ebara Corporation · 2005
- High-speed electron beam inspection58US 7,315,022 B1KLA-Tencor Technologies Corporation · 2008