E-beam exposure method and mask manufacturing method comprising the same

An E-beam exposure method comprising:

• receiving information on a pattern subject to exposure;
• determining on beams and off beams of an E-beam exposure apparatus;
• determining an exposure time in an exposure process;
• performing the exposure process using the E-beam exposure apparatus;
• measuring a first current of the off beams using a sensor on an aperture plate of the E-beam exposure apparatus;
• calculating a second current by normalizing the first current;
• calculating a third current by sampling the second current;
• a first determination of determining whether the exposure process for a set area is completed;
• and
• in response to determining the exposure process is not completed in the first determination, performing a second determination of determining whether the third current is within a reference range, wherein
• in response to the third current not being within the reference range in the second determination, the determining the exposure time is performed and the exposure time is changed, and
• in response to the third current being within the reference range in the second determination, the exposure process is performed without changing the exposure time.

A mask manufacturing method comprising:

• preparing a blank mask;
• applying an E-beam resist layer onto the blank mask;
• performing an E-beam exposure process on the E-beam resist layer;
• developing the E-beam resist layer to form an E-beam resist pattern;
• and
• etching a lower layer by using the E-beam resist pattern as an etch mask, wherein
• the performing of the E-beam exposure process includes receiving exposure information on a pattern subject to exposure, determining on beams and off beams of an E-beam exposure apparatus, determining an exposure time in an exposure process, performing the exposure process using the E-beam exposure apparatus, measuring a current of the off beams on an aperture plate of the E-beam exposure apparatus, and a first determination of determining whether the current is within a reference range, and
• in response to the current not being within the reference range in the first determination, the determining the exposure time is performed and the exposure time is changed.