H01G 4/085
Vapour deposited
Official title: {Vapour deposited}
H01G4/085 (Vapour deposited) appears on 120 US grants and 159 published applications in this corpus.
Search patents in H01G- Granted patents
- 120
- Published applications
- 159
- Assignees
- 69
- Inventors
- 356
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 4 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 0 |
| 2005 | 1 | 3 |
| 2006 | 2 | 4 |
| 2007 | 0 | 4 |
| 2008 | 2 | 6 |
| 2009 | 4 | 6 |
| 2010 | 4 | 6 |
| 2011 | 3 | 7 |
| 2012 | 3 | 6 |
| 2013 | 9 | 7 |
| 2014 | 7 | 4 |
| 2015 | 3 | 5 |
| 2016 | 6 | 3 |
| 2017 | 1 | 8 |
| 2018 | 5 | 12 |
| 2019 | 6 | 11 |
| 2020 | 7 | 8 |
| 2021 | 12 | 4 |
| 2022 | 3 | 9 |
| 2023 | 9 | 14 |
| 2024 | 4 | 14 |
| 2025 | 10 | 12 |
| 2026 | 7 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Metal spacer 3D-MIM capacitor4 Aug 2026US 12,701,723 B2International Business Machines Corporation
- Wire structure, wire capacitor, and electronic device including the wire capacitor16 Jun 2026US 12,658,341 B2Samsung Electronics Co., Ltd.
- Silicon capacitor with thin film deposition on 3D structure and its manufacturing method2 Jun 2026US 12,646,655 B2Elspes Inc.
- Film for film capacitors, metal laminate, film capacitor, power control unit, electric vehicle, and electric aircraft19 May 2026US 12,633,462 B2Toray Industries, Inc.
- Electrical device for high-voltage applications21 Apr 2026US 12,610,567 B2Murata Manufacturing Co., Ltd.
- Structure comprising two layers of different electrical nature and its preparation method24 Sep 2026US 2026/0290707 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Dielectric, capacitor, electric circuit, circuit board, apparatus, and power storage device27 Aug 2026US 2026/0250146 A1Panasonic Intellectual Property Management Co., Ltd.
- Capacitor component and integrated circuit chip package including same23 Jul 2026US 2026/0213079 A1Point Engineering Co., Ltd.
- Electrical device comprising a capacitor formed using a porous structure and conductive wires30 Apr 2026US 2026/0120956 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Capacitor, electric circuit, circuit board, device, capacitor component, and method for manufacturing capacitor12 Feb 2026US 2026/0045411 A1Panasonic Intellectual Property Management Co., Ltd.
Most cited
By later US patents
- Method for manufacturing a polycrystalline dielectric layer521US 8,667,654 B2STMicroelectronics (Crolles 2) SAS · 2014
- Method of manufacturing capacitive insulating film for capacitor449US 8,198,168 B2Elpida Memory, Inc. · 2012
- Lanthanide oxide dielectric layer108US 7,081,421 B2Micron Technology, Inc. · 2006
- Formation of thin film capacitors92US 6,207,522 B1MicroCoating Technologies, Inc. · 2001
- Formation of this film capacitors70US 6,270,835 B1MicroCoating Technologies, Inc. · 2001