G11C 2029/1206
Location of test circuitry on chip or wafer
Official title: {Location of test circuitry on chip or wafer}
G11C2029/1206 (Location of test circuitry on chip or wafer) appears on 174 US grants and 201 published applications in this corpus.
Search patents in G11C- Granted patents
- 174
- Published applications
- 201
- Assignees
- 81
- Inventors
- 432
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 3 |
| 2002 | 2 | 2 |
| 2003 | 3 | 6 |
| 2004 | 2 | 2 |
| 2005 | 2 | 3 |
| 2006 | 3 | 4 |
| 2007 | 2 | 5 |
| 2008 | 4 | 3 |
| 2009 | 1 | 3 |
| 2010 | 1 | 2 |
| 2011 | 5 | 2 |
| 2012 | 3 | 3 |
| 2013 | 1 | 5 |
| 2014 | 7 | 1 |
| 2015 | 2 | 5 |
| 2016 | 7 | 1 |
| 2017 | 5 | 5 |
| 2018 | 2 | 4 |
| 2019 | 8 | 16 |
| 2020 | 10 | 16 |
| 2021 | 19 | 29 |
| 2022 | 21 | 26 |
| 2023 | 26 | 21 |
| 2024 | 23 | 16 |
| 2025 | 11 | 7 |
| 2026 | 3 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Dynamic transmitter calibration21 Apr 2026US 12,609,155 B2QUALCOMM Incorporated
- Memory module with reduced ECC overhead and memory system17 Mar 2026US 12,580,035 B2Samsung Electronics Co., Ltd.
- Solder mask fault fiber optics sensor3 Feb 2026US 12,543,261 B2Micron Technology, Inc.
- Systems and method to test semiconductor devices2 Sep 2025US 12,405,300 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Computer architecture with disaggregated memory and high-bandwidth communication interconnects22 Jul 2025US 12,367,134 B2Luminous Computing, Inc.
- Memory system for detecting fault in signal transmission path23 Jul 2026US 2026/0212944 A1SK hynix Inc.
- Flexible systolic in-memory array testing device and control method thereof9 Jul 2026US 2026/0195227 A1Huazhong University of Science and Technology
- Storage device and operating method thereof9 Jul 2026US 2026/0196284 A1Samsung Electronics Co., Ltd.
- Storage device4 Jun 2026US 2026/0155179 A1Samsung Electronics Co., Ltd.
- Memory block maintenance prioritization based on access frequency14 May 2026US 2026/0134902 A1Micron Technology, Inc.
Most cited
By later US patents
- Data Processor having a built-in internal self test controller for testing a plurality of memories internal to the data processor157US 5,617,531 AMotorola, Inc. · 1997
- Partitionable embedded circuit test system for integrated circuit65US 6,587,979 B1Credence Systems Corporation · 2003
- Semiconductor integrated circuit device26US 6,436,741 B2Hitachi, Ltd. · 2002
- Tiered read reference calibration25US 10,991,444 B1Western Digital Technologies, Inc. · 2021
- System and method for testing one or more dies on a semiconductor wafer17US 7,119,567 B2Infineon Technologies North America Corp. · 2006