G05B 2219/45032
Wafer manufacture
Official title: Wafer manufacture; interlock, load-lock module
G05B2219/45032 (Wafer manufacture) appears on 51 US grants and 57 published applications in this corpus.
Search patents in G05B- Granted patents
- 51
- Published applications
- 57
- Assignees
- 32
- Inventors
- 144
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 1 |
| 2004 | 1 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 2 |
| 2012 | 0 | 1 |
| 2013 | 0 | 4 |
| 2014 | 4 | 1 |
| 2015 | 3 | 13 |
| 2016 | 6 | 6 |
| 2017 | 4 | 6 |
| 2018 | 7 | 2 |
| 2019 | 5 | 1 |
| 2020 | 3 | 3 |
| 2021 | 4 | 4 |
| 2022 | 1 | 3 |
| 2023 | 3 | 1 |
| 2024 | 3 | 3 |
| 2025 | 2 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Vibration determination in substrate processing systems18 Aug 2026US 12,710,737 B2APPLIED Materials.Inc.
- Matching process controllers for improved matching of process1 Apr 2025US 12,265,380 B2APPLIED Materials.Inc.
- Method for correcting robot21 Jan 2025US 12,202,151 B2Changxin Memory Technologies, Inc.
- Sensor-based correction of robot-held object12 Nov 2024US 12,142,503 B2APPLIED Materials.Inc.
- Teaching method14 May 2024US 11,984,340 B2Tokyo Electron Limited
- Die pairing manufacturing process2 Jul 2026US 2026/0186472 A1NVIDIA Corporation
- Matching process controllers for improved matching of process19 Jun 2025US 2025/0199521 A1APPLIED Materials.Inc.
- Vibration determination in substrate processing systems28 Nov 2024US 2024/0393761 A1APPLIED Materials.Inc.
- Control device, semiconductor manufacturing system, and control method of semiconductor manufacturing apparatus21 Nov 2024US 2024/0385582 A1Tokyo Electron Limited
- Digital simulation for semiconductor manufacturing processes3 Oct 2024US 2024/0329626 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Flexible tool for handling small objects11US 6,741,912 B2Microbotic A/S · 2004
- Method for controlling semiconductor equipment interlocked with a host computer7US 6,304,791 B1Samsung Electronics Co., Ltd. · 2001
- Interlocking apparatus6US 6,166,505 ACanon Kabushiki Kaisha · 2000
- Method for scheduling single-arm cluster tools with wafer revisiting and residency time constraints6US 9,223,307 B1Macau University of Science and Technology · 2015
- Optimal buffer space configuration and scheduling for single-arm multi-cluster tools6US 9,227,318 B1Macau University of Science and Technology · 2016