Die pairing manufacturing process
AssigneeNVIDIA Corporation
InventorsColin Sprinkle, Luai Nassar, Yin Fung Tang, Manas Mandal
Life of this patent
Estimating the term…
Abstract
An integrated circuit die binning process involves forming a batch of singulated die, configuring intersection regions of a multi-dimensional control structure with settings indicating die grouping compatibility, identifying a first die with the lowest die grouping compatibility, and randomly selecting a second die for grouping with the first die or voiding the first die from one dimension of the control structure, repeating these actions for more die from the batch.
Claims20
An integrated circuit die binning process comprising:
- (a) forming a batch of singulated die;
- (b) forming a control structure comprising a plurality of intersecting dimensions;
- (c) configuring intersection regions of the dimensions with settings indicating a die grouping compatibility;
- (d) identifying a first die comprising a lowest die grouping compatibility;
- (e) performing one of:
- based on the settings indicating die grouping compatibility, randomly selecting a second die for grouping with the first die in a product;
- or
- randomly voiding the first die from one dimension of the control structure;
- and repeating actions (a) through (e) for more die from the batch of singulated die.
An integrated circuit die binning process comprising:
- (a) forming a control structure comprising a plurality of intersecting dimensions;
- (b) configuring intersection regions of the dimensions with settings indicating a grouping compatibility for die in a batch of die;
- (c) identifying a first die comprising a lowest die grouping compatibility;
- (d) randomly selecting a second die for grouping with the first die in a product based on the settings indicating die grouping compatibility;
- (e) alternatively to (d), randomly voiding the first die from one dimension of the control structure;
- and
- (f) forming a die bin candidate by repeating actions (a) through (e) for more die from the batch of singulated die.
A computer system comprising:
- one or more graphics processing units;
- a memory configured with instructions that, when applied to the one or more graphics processing units, configure the computer system to:
- (a) form a control structure comprising a plurality of intersecting dimensions;
- (b) configure intersection regions of the dimensions with settings indicating a grouping compatibility for die in a batch of die;
- (c) identify a first die comprising a lowest die grouping compatibility;
- (d) randomly select a second die for grouping with the first die in a product based on the settings indicating die grouping compatibility;
- (e) alternatively to (d), randomly void the first die from one dimension of the control structure;
- and
- (f) form a die bin candidate by repeating actions (a) through (e) for more die from the batch of singulated die.
Dependencies are inferred from the claim text.