G03F 7/343
Lamination or delamination methods or apparatus for photolitographic photosensitive material
Official title: {Lamination or delamination methods or apparatus for photolitographic photosensitive material}
G03F7/343 (Lamination or delamination methods or apparatus for photolitographic photosensitive material) appears on 66 US grants and 50 published applications in this corpus.
Search patents in G03F- Granted patents
- 66
- Published applications
- 50
- Assignees
- 44
- Inventors
- 168
- Latest grant
- 5 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 5 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 2 | 1 |
| 2003 | 0 | 1 |
| 2004 | 2 | 0 |
| 2005 | 0 | 0 |
| 2006 | 2 | 5 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 1 | 3 |
| 2011 | 0 | 0 |
| 2012 | 1 | 3 |
| 2013 | 2 | 1 |
| 2014 | 1 | 2 |
| 2015 | 5 | 3 |
| 2016 | 1 | 5 |
| 2017 | 0 | 1 |
| 2018 | 3 | 4 |
| 2019 | 3 | 3 |
| 2020 | 3 | 3 |
| 2021 | 2 | 2 |
| 2022 | 1 | 2 |
| 2023 | 2 | 5 |
| 2024 | 1 | 1 |
| 2025 | 4 | 4 |
By publication year. Applications have been published since 2001.
Recent patents
- Material for forming organic film, patterning process, compound, and polymer5 Aug 2025US 12,379,662 B2Shin-Etsu Chemical Co., Ltd.
- Method of removing photoresist, laminate, method of forming metallic pattern, polyimide resin and stripper3 Jun 2025US 12,321,097 B2eChem Solutions Corp.
- Flow cells and methods for making the same13 May 2025US 12,298,665 B2Illumina, Inc.
- Method of fabricating structured membranes25 Mar 2025US 12,259,656 B1United States of America as represented by the Administrator of NASA
- Photosensitive polyimide compositions13 Feb 2024US 11,899,364 B2Fujifilm Electronic Materials U.S.A., Inc.
- Resist composition, laminate, and pattern forming process18 Sep 2025US 2025/0291249 A1Shin-Etsu Chemical Co., Ltd.
- Photosensitive resin composition, photosensitive element, printed wiring board, and method for producing printed wiring board28 Aug 2025US 2025/0271758 A1
- Resin composition24 Jul 2025US 2025/0236719 A1Murata Manufacturing Co., Ltd.
- Film forming method and film forming apparatus10 Jul 2025US 2025/0224676 A1Tokyo Electron Limited
- Substrate treatment method, and computer storage medium1 Feb 2024US 2024/0036473 A1Tokyo Electron Limited
Most cited
By later US patents
- Method and apparatus for thermal processing a photosensitive element52US 6,797,454 B1E. I. Du Pont de Nemours and Company · 2004
- Resist removing method, and curable pressure-sensitive adhesive, adhesive sheets and apparatus used for the method47US 5,466,325 AHitachi, Ltd. · 1995
- Apparatus and method for controlling the delamination of a laminate34US 5,141,584 APolaroid Corporation · 1992
- Stripping and developing process and device therefor29US 4,183,751 AFuji Photo Film Co., Ltd. · 1980
- Peeling type developing apparatus27US 4,631,110 ANitto Electric Industrial Co., Ltd. · 1986